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? december 2011 altera corporation package information datasheet for mature altera devices package information datasheet for mature altera devices this datasheet provides package and thermal resistance information for mature altera ? devices. package information includes the ordering code reference, package acronym, leadframe material, lead finish (plating), jedec outline reference, lead coplanarity, weight, moisture sensitivity level, and other special information. the thermal resistance information includes device pin count, package name, and resistance values. this datasheet includes the following sections: ?device and package cross reference? on page 1 ?thermal resistance? on page 23 ?package outlines? on page 44 f for more package and thermal resistance information about altera devices that are not listed in this datasheet, refer to the package and thermal resistance page of the altera website. f for information about trays, tubes, and dry packs, refer to an 71: guidelines for handling j-lead, qfp, and bga devices . f rohs-compliant devices are compatible with leaded-reflow temperatures. for more information, refer to altera?s rohs-compliant devices literature page. device and package cross reference table 2 through table 22 lists the device, package type, and number of pins for each altera device listed in this datasheet. altera devices listed in this datasheet are available in the following packages: ball-grid array (bga) ceramic pin-grid array (pga) fineline bga (fbga) hybrid fineline bga (hbga) plastic dual in-line package (pdip) plastic enhanced quad flat pack (eqfp) plastic j-lead chip carrier (plcc) plastic quad flat pack (pqfp) power quad flat pack (rqfp) thin quad flat pack (tqfp) ultra fineline bga (ubga) ds-pkg-16.8
2 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation table 1 lists the altera devices and the associated table locations. table 1. mature altera device and package cross reference altera device table locations arria ? series fpgas arria gx devices: table 2 on page 3 stratix ? series fpgas stratix ii devices: table 3 on page 3 stratix devices: table 4 on page 5 cyclone ? series fpgas cyclone ii devices: table 5 on page 7 cyclone devices: table 6 on page 8 max ? series cplds max 9000 devices: table 7 on page 8 max 7000 devices: table 8 on page 9 max 3000a devices: table 9 on page 10 hardcopy ? series asics hardcopy ii devices: table 10 on page 11 hardcopy devices: table 11 on page 11 hardcopy apex devices: table 12 on page 12 apex? series fpgas apex ii devices: table 13 on page 13 apex 20ke devices: table 14 on page 13 apex 20kc devices: table 15 on page 15 apex 20k devices: table 16 on page 15 acex ? 1k fpgas acex 1k devices: table 17 on page 16 mercury? fpgas mercury devices: table 18 on page 17 flex ? series fpgas flex 10ka devices: table 19 on page 17 flex 10ks devices: table 20 on page 18 flex 10ke devices: table 21 on page 18 excalibur? fpgas excalibur devices: table 22 on page 21 configuration devices configuration devices: table 23 on page 22 enhanced configuration devices enhanced configuration devices: table 24 on page 22
package information datasheet for mature altera devices 3 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices arria gx devices table 2 lists the device name, package type, and number of pins for the arria gx device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. stratix ii devices table 3 lists the device name, package type, and number of pins for the stratix ii device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 2. arria gx devices device package pins ep1agx20 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 ep1agx35 dual-piece lid: fbga, flip chip, option 1 single- piece lid: fbga, flip chip, option 4 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 ep1agx50 channel lid: fbga, flip chip, option 1 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1152 ep1agx60 channel lid: fbga, flip chip, option 1 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1152 ep1agx90 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1152 table 3. stratix ii devices (part 1 of 2) device package pins ep2s15 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 672
4 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation ep2s30 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 672 ep2s60 dual-piece lid: fbga, flip chip, option 1 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 672 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 ep2s90 channel lid: hbga, flip chip 484 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep2s130 channel lid: fbga, flip chip, option 1 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep2s180 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep2sgx30 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 ep2sgx60 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1152 ep2sgx90 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1152 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep2sgx130 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 table 3. stratix ii devices (part 2 of 2) device package pins
package information datasheet for mature altera devices 5 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices stratix devices table 4 lists the device name, package type, and number of pins for the stratix device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 4. stratix devices (part 1 of 2) device package pins ep1sgx10 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 672 ep1sgx25 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 672 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 ep1sgx40 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 ep1s10 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 484 bga, wire bond 672 fbga, wire bond, option 2 672 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 ep1s20 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 4 484 bga, wire bond 672 fbga, wire bond, option 2 672 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 ep1s25 bga, wire bond 672 fbga, wire bond, option 2 672 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 ep1s30 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: bga, flip chip, option 1 single-piece lid: bga, flip chip, option 2 956 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020
6 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation ep1s40 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 3 780 dual-piece lid: bga, flip chip, option 1 single-piece lid: bga, flip chip, option 2 956 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep1s60 dual-piece lid: bga, flip chip, option 1 single-piece lid: bga, flip chip, option 2 956 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 ep1s80 dual-piece lid: bga, flip chip, option 1 single-piece lid: bga, flip chip, option 2 956 dual-piece lid: fbga, flip chip, option 1 1020 dual-piece lid: fbga, flip chip, option 1 single-piece lid: fbga, flip chip, option 2 1508 table 4. stratix devices (part 2 of 2) device package pins
package information datasheet for mature altera devices 7 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices cyclone ii devices table 5 lists the device name, package type, and number of pins for the cyclone ii device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 5. cyclone ii devices device package pins ep2c5 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 2, thin 256 ep2c8 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 2, thin 256 ep2c8a fbga, wire bond, option 2, thin 256 ep2c15a fbga, wire bond, option 2, thin 256 fbga, wire bond, a:2.40 484 ep2c20 pqfp, wire bond 240 fbga, wire bond, option 2, thin 256 fbga, wire bond, a:2.40 484 ep2c20a fbga, wire bond, option 2, thin 256 fbga, wire bond, a:2.40 484 ep2c35 fbga, wire bond, a:2.40 484 ubga, wire bond 484 fbga, wire bond, a:2.40 672 ep2c50 fbga, wire bond, a:2.40 484 ubga, wire bond 484 fbga, wire bond, a:2.40 672 ep2c70 fbga, wire bond, a:2.40 672 fbga, wire bond, a:2.40 896
8 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation cyclone devices table 6 lists the device name, package type, and number of pins for the cyclone device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. max 9000 devices table 7 lists the device name, package type, and number of pins for the max 9000 device family. max 7000 devices table 8 lists the device name, package type, and number of pins for the max 7000 device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 6. cyclone devices device package pins ep1c3 tqfp, wire bond 100 tqfp, wire bond 144 ep1c4 fbga, wire bond, option 1 324 fbga, wire bond 400 ep1c6 tqfp, wire bond 144 pqfp, wire bond 240 fbga, wire bond, option 1 256 ep1c12 pqfp, wire bond 240 fbga, wire bond, option 1 256 fbga, wire bond, option 1 324 ep1c20 fbga, wire bond, option 1 324 fbga, wire bond 400 table 7. max 9000 devices device package pins epm9320 bga, wire bond 356 epm9320a bga, wire bond 356 epm9560 bga, wire bond 356
package information datasheet for mature altera devices 9 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices table 8. max 7000 devices (part 1 of 2) device package pins epm7032b plcc, wire bond 44 tqfp, wire bond 44 ubga, wire bond 49 epm7064b tqfp, wire bond 44 ubga, wire bond 49 fbga, wire bond, option 1 100 tqfp, wire bond 100 epm7128b ubga, wire bond 49 tqfp, wire bond 100 fbga, wire bond, option 1 100 tqfp, wire bond 144 ubga, wire bond 169 fbga, wire bond, option 1 256 epm7256b tqfp, wire bond 100 tqfp, wire bond 144 ubga, wire bond 169 pqfp, wire bond 208 fbga, wire bond, option 1 256 epm7512b tqfp, wire bond 144 ubga, wire bond 169 pqfp, wire bond 208 fbga, wire bond, option 1 256 bga, wire bond, option 1 256 EPM7032Ae plcc, wire bond 44 tqfp, wire bond 44 epm7064ae plcc, wire bond 44 ubga, wire bond 49 fbga, wire bond, option 1 100 tqfp, wire bond 44 tqfp, wire bond 100 fbga, wire bond, option 1 256 epm7128ae plcc, wire bond 84 fbga, wire bond, option 1 100 tqfp, wire bond 100 tqfp, wire bond 144 ubga, wire bond 169 fbga, wire bond, option 1 256
10 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation max 3000a devices table 8 lists the device name, package type, and number of pins for the max 3000a device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. epm7256ae tqfp, wire bond 100 fbga, wire bond, option 1 100 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 epm7512ae tqfp, wire bond 144 pqfp, wire bond 208 bga, wire bond, option 1 256 fbga, wire bond, option 1 256 EPM7032A plcc, wire bond 44 tqfp, wire bond 44 epm7128a plcc, wire bond 84 tqfp, wire bond 100 fbga, wire bond 100 tqfp, wire bond 144 fbga, wire bond, option 1 256 epm7256a tqfp, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 epm7192e pga, wire bond 160 pqfp, wire bond 160 table 8. max 7000 devices (part 2 of 2) device package pins table 9. max 3000a devices (part 1 of 2) device package pins epm3032a plcc, wire bond 44 tqfp, wire bond 44 epm3064a tqfp, wire bond 44 plcc, wire bond 44 tqfp, wire bond 100 epm3128a tqfp, wire bond 100
package information datasheet for mature altera devices 11 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices hardcopy ii devices table 10 lists the device name, package type, and number of pins for the hardcopy ii device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. hardcopy devices table 11 lists the device name, package type, and number of pins for the hardcopy device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. epm3256a tqfp, wire bond 144 pqfp, wire bond 208 epm3512a pqfp, wire bond 208 fbga, wire bond, option 1 256 table 9. max 3000a devices (part 2 of 2) device package pins table 10. hardcopy ii devices device package pins hc210 fbga, wire bond, a:2.40 484 hc220 single-piece lid: fbga, flip chip, option 4 672 single-piece lid: fbga, flip chip, option 3 780 hc230 single-piece lid: fbga, flip chip, option 2 1020 hc240 single-piece lid: fbga, flip chip, option 2 1020 single-piece lid: fbga, flip chip, option 2 1508 table 11. hardcopy devices device package pins hc1s25 fbga, wire bond, a:2.40 672 bga, wire bond 672 hc1s30 dual-piece lid: fbga, flip chip, option 1 780 hc1s40 dual-piece lid: fbga, flip chip, option 1 780 hc1s60 dual-piece lid: fbga, flip chip, option 1 1020 hc1s80 dual-piece lid: fbga, flip chip, option 1 1020
12 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation hardcopy apex devices table 12 lists the device name, package type, and number of pins for the hardcopy apex device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 12. hardcopy apex devices device package pins hc20k400 bga, wire bond, option 3 652 hc20k600 bga, wire bond, option 3 652 dual-piece lid: fbga, flip chip, option 1 672
package information datasheet for mature altera devices 13 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices apex ii devices table 13 lists the device name, package type, and number of pins for the apex ii device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. apex 20ke devices table 14 lists the device name, package type, and number of pins for the apex 20ke device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 13. apex ii devices device package pins ep2a15 dual-piece lid: fbga, flip chip, option 1 672 dual-piece lid: bga, flip chip 724 ep2a25 channel lid: fbga, flip chip, option 1 672 dual-piece lid: bga, flip chip 724 dual-piece lid: fbga, flip chip, option 1 1020 ep2a40 channel lid: fbga, flip chip, option 1 672 dual-piece lid: bga, flip chip 724 dual-piece lid: fbga, flip chip, option 1 1020 ep2a70 dual-piece lid: bga, flip chip 724 dual-piece lid: fbga, flip chip, option 1 1508 table 14. apex 20ke devices (part 1 of 2) device package pins ep20k30e fbga, wire bond 144 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 324 ep20k60e fbga, wire bond 144 tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 324 bga, wire bond 356
14 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation ep20k100e fbga, wire bond 144 tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 324 bga, wire bond 356 ep20k160e tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 ep20k200e pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 bga, wire bond, option 2 652 fbga, wire bond, option 2 672 ep20k300e pqfp, wire bond 240 bga, wire bond, option 2 652 fbga, wire bond, option 2 672 ep20k400e bga, wire bond, option 3 652 fbga, flip chip, option 1 672 ep20k600e bga, wire bond, option 3 652 fbga, flip chip, option 1 672 fbga, flip chip, option 1 1020 ep20k1000e bga, flip chip 652 fbga, flip chip, option 1 672 fbga, flip chip, option 1 1020 ep20k1500e bga, flip chip 652 fbga, flip chip, option 1 1020 table 14. apex 20ke devices (part 2 of 2) device package pins
package information datasheet for mature altera devices 15 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices apex 20kc devices table 15 lists the device name, package type, and number of pins for the apex 20kc device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. apex 20k devices table 16 lists the device name, package type, and number of pins for the apex 20k device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 15. apex 20kc devices device package pins ep20k200c pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 ep20k400c bga, wire bond, option 3 652 fbga, flip chip, option 1 672 ep20k600c bga, wire bond, option 3 652 fbga, flip chip, option 1 672 fbga, flip chip, option 1 1020 ep20k1000c bga, flip chip 652 fbga, flip chip, option 1 672 fbga, flip chip, option 1 1020 table 16. apex 20k devices (part 1 of 2) device package pins ep20k100 tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 324 bga, wire bond 356 ep20k160 pqfp, wire bond 240 tqfp, wire bond 144
16 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation acex 1k devices table 17 lists the device name, package type, and number of pins for the ace 1k device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. ep20k200 pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 ep20k300 fbga, wire bond, option 2 672 ep20k400 bga, wire bond, option 3 652 pga, wire bond 655 fbga, flip chip, option 1 672 table 16. apex 20k devices (part 2 of 2) device package pins table 17. acex 1k devices device package pins ep1k10 tqfp, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 ep1k30 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 ep1k50 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 fbga, wire bond, option 2 484 ep1k100 pqfp, wire bond 208 fbga, wire bond, option 1 256 fbga, wire bond, option 2 484
package information datasheet for mature altera devices 17 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices mercury devices table 18 lists the device name, package type, and number of pins for the mercury device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. flex 10ka devices table 19 lists the device name, package type, and number of pins for the flex 10ka device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 18. mercury devices device package pins ep1m120 dual-piece lid: fbga, flip chip, option 1 484 ep1m350 dual-piece lid: fbga, flip chip, option 1 780 table 19. flex 10ka devices device package pins epf10k10a tqfp, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 epf10k30a tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 256 bga, wire bond 356 fbga, wire bond, option 2 484 epf10k100a rqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 bga, wire bond 600 epf10k250a pga, wire bond 599 bga, wire bond 600
18 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation flex 10ks devices table 20 lists the device name, package type, and number of pins for the flex 10ks device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. flex 10ke devices table 21 lists the device name, package type, and number of pins for the flex 10ke device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 20. flex 10ks devices device package pins epf10k50s tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 256 bga, wire bond 356 fbga, wire bond, option 2 484 epf10k200s rqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 bga, wire bond 600 fbga, wire bond, option 2 672 table 21. flex 10ke devices (part 1 of 3) device package pins epf10k30e tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 fbga, wire bond, option 2 484 epf10k50e tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 256 bga, wire bond 356 fbga, wire bond, option 2 484
package information datasheet for mature altera devices 19 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices epf10k100e pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 256 bga, wire bond 356 fbga, wire bond, option 2 484 epf10k130e pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 bga, wire bond 600 fbga, wire bond, option 2 672 epf10k200e pga, wire bond 599 bga, wire bond 600 fbga, wire bond, option 2 672 epf10k10 plcc, wire bond 84 tqfp, wire bond 144 pqfp, wire bond 208 epf10k20 tqfp, wire bond 144 rqfp, wire bond 208 rqfp, wire bond 240 epf10k30 rqfp, wire bond 208 rqfp, wire bond 240 bga, wire bond 356 epf10k40 rqfp, wire bond 208 rqfp, wire bond 240 epf10k50 rqfp, wire bond 240 bga, wire bond 356 pga, wire bond 403 epf10k50v rqfp, wire bond 240 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond 484 epf10k70 rqfp, wire bond 240 pga, wire bond 503 epf10k100 pga, wire bond 503 epf10k130v pga, wire bond 599 bga, wire bond 600 epf6010a tqfp, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 table 21. flex 10ke devices (part 2 of 3) device package pins
20 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation epf10k100e pqfp, wire bond 208 pqfp, wire bond 240 fbga, wire bond, option 1 256 bga, wire bond 356 fbga, wire bond, option 2 484 epf10k130e pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond, option 2 484 bga, wire bond 600 fbga, wire bond, option 2 672 epf10k200e pga, wire bond 599 bga, wire bond 600 fbga, wire bond, option 2 672 epf10k10 plcc, wire bond 84 tqfp, wire bond 144 pqfp, wire bond 208 epf10k20 tqfp, wire bond 144 rqfp, wire bond 208 rqfp, wire bond 240 epf10k30 rqfp, wire bond 208 rqfp, wire bond 240 bga, wire bond 356 epf10k40 rqfp, wire bond 208 rqfp, wire bond 240 epf10k50 rqfp, wire bond 240 bga, wire bond 356 pga, wire bond 403 epf10k50v rqfp, wire bond 240 pqfp, wire bond 240 bga, wire bond 356 fbga, wire bond 484 epf10k70 rqfp, wire bond 240 pga, wire bond 503 epf10k100 pga, wire bond 503 epf10k130v pga, wire bond 599 bga, wire bond 600 epf6010a tqfp, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 table 21. flex 10ke devices (part 2 of 3) device package pins
package information datasheet for mature altera devices 21 device and package cross reference ? december 2011 altera corporation package information datasheet for mature altera devices excalibur devices table 22 lists the device name, package type, and number of pins for the excalibur device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. epf6016 tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond, option 2 256 epf6016a tqfp, wire bond 100 fbga, wire bond 100 tqfp, wire bond 144 pqfp, wire bond 208 fbga, wire bond, option 1 256 epf6024a tqfp, wire bond 144 pqfp, wire bond 208 pqfp, wire bond 240 bga, wire bond, option 2 256 fbga, wire bond, option 1 256 epf8282a plcc, wire bond 84 tqfp, wire bond 100 epf8452a tqfp, wire bond 100 pqfp, wire bond 160 table 21. flex 10ke devices (part 3 of 3) device package pins table 22. excalibur devices device package pins epxa1 fbga, wire bond, option 2 484 dual-piece lid: fbga, flip chip, option 1 672 epxa4 dual-piece lid: fbga, flip chip, option 1 672 dual-piece lid: fbga, flip chip, option 1 1020 epxa10 dual-piece lid: fbga, flip chip, option 1 1020
22 package information datasheet for mature altera devices device and package cross reference package information datasheet for mature altera devices ? december 2011 altera corporation configuration devices table 23 lists the device name, package type, and number of pins for the configuration device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. enhanced configuration devices table 24 lists the device name, package type, and number of pins for the enhanced configuration device family. 1 the package type entries with ?option #? refer to instances where multiple package options exist for a given package type and pin count. the option number identifies the specific type used by the corresponding device density. table 23. configuration devices device package pins epc1 pdip, wire bond 8 plcc, wire bond 20 epc2 plcc, wire bond 20 tqfp, wire bond 32 epc1064 pdip, wire bond 8 plcc, wire bond 20 epc1213 pdip, wire bond 8 plcc, wire bond 20 epc1441 pdip, wire bond 8 plcc, wire bond 20 tqfp, wire bond 32 table 24. enhanced configuration devices device package pins epc4 pqfp, wire bond 100 epc8 pqfp, wire bond 100 epc16 ubga, wire bond 88 pqfp, wire bond 100
package information datasheet for mature altera devices 23 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices thermal resistance altera follows jedec jesd51 series standards to provide thermal resistances. the purpose of the jesd51 standards is to compare the thermal performance of various packages under standardized test conditions. while standardized thermal resistances can help compare the relative thermal performance of different packages, they cannot apply directly to the many specific applications because jesd51 test conditions may not match a specific application. several factors affect the thermal performance of a device in a user?s application. these include power dissipation in the component; airflow velocity, direction and turbulence level; power in adjacent components; two-sided vs. one-sided active component mounting; printed circuit board (pcb) orientation & construction; and adjacent boards and their power dissipation. it may be necessary to test or model specific applications. this testing and modeling of a component user?s specific applications is the user?s responsibility. table 26 through table 43 provide ? ja (junction-to-ambientthermalresistance)and ? jc (junction-to-case thermal resistance) values for the altera device families. altera reserves the right to make changes to thermal resistances without notice in the future. table 25 lists the mature altera devices and the associated table locations. altera is transitioning to an industry-standard copper lid for its thermally enhanced bga and thermally enhanced flip chip fbga package offerings. f for more information, refer to process change notice pcn0214 . table 25. thermal resistance altera device table location arria series fpgas arria gx devices: table 26 on page 24 stratix series fpgas stratix ii devices: table 27 on page 25 stratix devices: table 28 on page 26 cyclone series fpgas cyclone ii devices: table 29 on page 27 cyclone devices: table 30 on page 28 max series cplds max 9000 devices: table 31 on page 29 max 7000 devices: table 32 on page 30 max 3000a devices: table 33 on page 33 hardcopy series asics hardcopy ii devices: table 34 on page 34 hardcopy devices: table 35 on page 34 apex series fpgas apex ii devices: table 36 on page 35 apex 20k: table 37 on page 36 acex 1k fpgas acex 1k devices: table 38 on page 38 mercury fpgas mercury devices: table 39 on page 39 flex series fpgas flex 10k devices: table 40 on page 39 flex 8000 devices: table 41 on page 41 flex 6000 devices: table 42 on page 42 excalibur fpgas excalibur devices: table 43 on page 43
24 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation this change affects the apex 20ke, apex 20kc, apex ii, mercury, and excalibur device families. therefore, two thermal resistance specifications are provided for devices affected by this change. the older packages are identified as using the aluminum silicon carbide (alsic) lid, while the newer packages are identified as using the copper (cu) lid. thermally enhanced bga and thermally enhanced flip chip fbga packages offered in the newer altera families, including stratix and stratix gx, were introduced using an industry-standard cu lid. therefore, these device specifications include only a single thermal resistance specification. 1 contact altera if you need typical +/? values of a dimensions for thermal analysis. the max numbers are provided for physical layout. arria series devices thermal resistance table 26 provides thermal resistance values for arria series devices. arria gx devices table 26 lists the thermal resistance of arria gx devices. table 26. thermal resistance of arria gx devices device package pin count ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ? jc ( c/w) ? jb ( c/w) ep1agx20 fbga 484 12.8 10.3 8.7 7.5 0.3 3.1 fbga 780 11.1 8.6 7.2 6.0 0.2 3.1 ep1agx35 fbga 484 12.8 10.3 8.7 7.5 0.3 3.1 fbga 780 11.1 8.6 7.2 6.0 0.2 3.1 ep1agx50 fbga 484 12.7 10.2 8.6 7.3 0.2 2.9 fbga 780 10.9 8.4 6.9 5.8 0.2 2.9 fbga 1152 9.9 7.5 6.1 5.0 0.2 2.5 ep1agx60 fbga 484 12.7 10.2 8.6 7.3 0.2 2.9 fbga 780 10.9 8.4 6.9 5.8 0.2 2.8 fbga 1152 9.9 7.5 6.1 5.0 0.2 2.5 ep1agx90 fbga 1152 9.6 7.3 5.9 4.9 0.1 2.3
package information datasheet for mature altera devices 25 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices stratix series devices thermal resistance table 27 to table 28 provide thermal resistance values for stratix series devices. stratix ii devices table 27 lists the thermal resistance of stratix ii devices. table 27. thermal resistance of stratix ii devices (part 1 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ? jb ( c/w) ep2s15 fbga, flip chip 484 0.4 13.1 11.1 9.6 8.3 4.2 fbga, flip chip 672 0.4 12.2 10.2 8.8 7.6 4.1 ep2s30 fbga, flip chip 484 0.2 12.6 10.6 9.1 7.9 3.7 fbga, flip chip 672 0.2 11.7 9.7 8.3 7.1 3.4 ep2s60 fbga, flip chip 484 0.1 12.3 10.3 8.8 7.5 3.4 fbga, flip chip 672 0.1 11.4 9.4 7.8 6.7 3.0 fbga, flip chip 1020 0.1 10.4 8.4 7.0 5.9 2.7 ep2s90 hbga, flip chip 484 0.1 12.0 9.9 8.3 7.1 3.7 fbga, flip chip 780 0.1 10.8 8.8 7.3 6.1 2.6 fbga, flip chip 1020 0.1 10.2 8.2 6.8 5.7 2.4 fbga, flip chip 1508 0.1 9.3 7.4 6.1 5.0 2.2 ep2s130 fbga, flip chip 780 0.1 10.1 8.7 7.2 6.0 2.4 fbga, flip chip 1020 0.1 9.5 8.1 6.7 5.5 2.2 fbga, flip chip 1508 0.1 8.6 7.3 6.0 4.8 2.1 ep2s180 fbga, flip chip 1020 0.1 9.0 7.9 6.5 5.4 2.1 fbga, flip chip 1508 0.1 8.1 7.1 5.8 4.7 1.9 ep2sgx30 fbga, flip chip 780 0.2 11.1 8.6 7.2 6.0 3.1 ep2sgx60 fbga, flip chip 780 0.2 10.9 8.4 6.9 5.8 2.8 fbga, flip chip 1152 0.2 9.9 7.5 6.1 5.0 2.5
26 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation stratix devices table 28 lists the thermal resistance of stratix devices. ep2sgx90 fbga, flip chip 1152 0.1 9.6 7.3 5.9 4.9 2.3 fbga, flip chip 1508 0.1 9.0 6.7 5.4 4.4 1.9 ep2sgx130 fbga, flip chip 1508 0.1 8.3 6.6 5.3 4.3 1.8 table 27. thermal resistance of stratix ii devices (part 2 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ? jb ( c/w) table 28. thermal resistance of stratix devices (part 1 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1sgx10c ep1sgx10d fbga, flip chip 672 0.4 11.1 9.1 7.7 6.5 ep1sgx25c ep1sgx25d fbga, flip chip 672 0.2 10.8 8.8 7.4 6.2 ep1sgx25d ep1sgx25f fbga, flip chip 1020 0.2 9.9 7.9 6.5 5.4 ep1sgx40d ep1sgx40g fbga, flip chip 1020 0.2 9.8 7.7 6.4 5.3 ep1s10 fbga, flip chip 484 0.4 11.9 9.8 8.4 7.2 bga 672 3.2 16.8 13.7 11.9 10.5 fbga 672 3.4 17.2 14.0 12.2 10.8 fbga, flip chip 780 0.4 10.9 8.8 7.4 6.3 ep1s20 fbga, flip chip 484 0.3 11.8 9.7 8.3 7.1 bga 672 2.5 15.5 12.4 10.7 9.3 fbga 672 2.7 16.0 12.8 11.0 9.6 fbga, flip chip 780 0.3 10.7 8.6 7.2 6.1 ep1s25 bga 672 2.2 14.8 11.7 10.0 8.7 fbga 672 2.3 15.3 12 10.4 9.0 fbga, flip chip 780 0.3 10.5 8.5 7.1 6.0 fbga, flip chip 1020 0.3 10.0 8.0 6.6 5.5
package information datasheet for mature altera devices 27 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices cyclone series devices thermal resistance table 29 to table 30 provide thermal resistance values for cyclone series devices. cyclone ii devices table 29 lists the thermal resistance of cyclone ii devices. device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1s30 fbga, flip chip 780 0.2 10.4 8.4 7.0 5.9 bga, flip chip 956 0.2 9.1 7.1 5.8 4.8 fbga, flip chip 1020 0.2 9.9 7.9 6.5 5.4 ep1s40 fbga, flip chip 780 0.2 10.4 8.3 6.9 5.8 bga, flip chip 956 0.2 9.0 7.0 5.7 4.7 fbga, flip chip 1020 0.2 9.8 7.8 6.4 5.3 fbga, flip chip 1508 0.2 9.1 7.1 5.8 4.7 ep1s60 bga, flip chip 956 0.1 8.9 6.9 5.6 4.6 fbga, flip chip 1020 0.1 9.7 7.7 6.3 5.2 fbga, flip chip 1508 0.1 8.9 7.0 5.6 4.6 ep1s80 bga, flip chip 956 0.1 8.8 6.8 5.5 4.5 fbga, flip chip 1020 0.1 9.6 7.6 6.2 5.1 fbga, flip chip 1508 0.1 8.8 6.9 5.5 4.5 table 28. thermal resistance of stratix devices (part 2 of 2) table 29. thermal resistance of cyclone ii devices (part 1 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep2c5 tqfp, wire bond 144 10.0 31.0 29.3 27.9 25.5 pqfp, wire bond 208 5.5 30.4 29.2 27.3 22.3 fbga, wire bond 256 8.7 30.2 26.1 23.6 21.7
28 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation cyclone devices table 30 lists the thermal resistance of cyclone devices. ep2c8 tqfp, wire bond 144 9.9 29.8 28.3 26.9 24.9 pqfp, wire bond 208 5.4 30.2 28.8 26.9 21.7 fbga, wire bond 256 7.1 27.0 23.0 20.5 18.5 ep2c15 fbga, wire bond 256 5.5 24.2 20.0 17.8 16.0 fbga, wire bond 484 4.2 21.0 17.0 14.8 13.1 ep2c20 pqfp, wire bond 240 4.2 26.6 24.0 21.4 17.4 fbga, wire bond 256 5.5 24.2 20.0 17.8 16.0 fbga, wire bond 484 4.2 21.0 17.0 14.8 13.1 ep2c35 fbga, wire bond 484 3.3 19.4 15.4 13.3 11.7 ubga, wire bond 484 5.0 20.6 16.6 14.5 12.8 fbga, wire bond 672 3.1 18.6 14.6 12.6 11.1 ep2c50 fbga, wire bond 484 2.8 18.4 14.4 12.4 10.9 ubga, wire bond 484 4.4 19.6 15.6 13.6 11.9 fbga, wire bond 672 2.6 17.7 13.7 11.8 10.2 ep2c70 fbga, wire bond 672 2.2 16.9 13.0 11.1 9.7 fbga, wire bond 896 2.1 16.3 11.9 10.5 9.1 table 29. thermal resistance of cyclone ii devices (part 2 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. table 30. thermal resistance of cyclone devices (part 1 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1c3 tqfp 100 11.0 37.5 35.4 33.4 29.8 tqfp 144 10.0 31.1 29.4 27.9 25.5 ep1c6 tqfp 144 9.8 29.4 28.0 26.7 24.7 pqfp 240 4.3 27.2 24.7 22.1 17.8 fbga 256 8.8 28.7 24.5 22.3 20.5
package information datasheet for mature altera devices 29 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices max series devices thermal resistance table 31 through table 33 provide thermal resistance values for max series devices. max 9000 devices table 31 lists the thermal resistance of max 9000 devices. device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1c12 pqfp 240 4.0 26.0 23.4 20.8 17.1 fbga 256 6.6 24.3 20.2 18.1 16.4 fbga 324 6.1 23.0 19.8 17.7 16.1 ep1c20 fbga 324 5.0 21.0 17.7 15.6 14.1 fbga 400 4.7 20.7 17.5 15.5 13.9 table 30. thermal resistance of cyclone devices (part 2 of 2) table 31. thermal resistance of max 9000 devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epm9320 plcc 84 9.0 29.0 27.0 25.0 23.0 rqfp 208 1.0 17.0 16.0 15.0 13.0 pga 280 2.0 14.0 10.0 7.0 5.0 bga 356 2.0 14.0 12.0 11.0 10.0 epm9320a plcc 84 9.0 29.0 27.0 26.0 23.0 rqfp 208 2.0 17.0 16.0 15.0 13.0 bga 356 1.0 12.0 11.0 10.0 9.0 epm9400 plcc 84 9.0 29.0 27.0 25.0 23.0 rqfp 208 1.0 17.0 16.0 15.0 13.0 rqfp 240 1.0 14.0 12.0 11.0 10.0 epm9480 rqfp 208 1.0 17.0 16.0 15.0 12.0 rqfp 240 1.0 12.0 11.0 10.0 9.0 epm9560 rqfp 208 1.0 17.0 16.0 15.0 12.0 rqfp 240 1.0 12.0 11.0 10.0 9.0 bga 356 1.0 12.0 11.0 10.0 9.0 epm9560a rqfp 208 1.0 17.0 16.0 15.0 12.0 rqfp 240 1.0 11.0 10.0 9.0 8.0 bga 356 1.0 12.0 11.0 10.0 9.0
30 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation max 7000 devices table 32 lists the thermal resistance of max 7000 devices. table 32. thermal resistance of max 7000 devices (part 1 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epm7032 plcc 44 10.0 33.0 31.0 30.0 27.0 pqfp 15.0 48.0 46.0 45.0 42.0 tqfp 14.0 46.0 44.0 43.0 40.0 epm7032b plcc 44 10.0 33.0 31.0 30.0 27.0 tqfp 14.0 46.0 44.0 43.0 40.0 ubga 49 23.0 69.0 67.0 66.0 62.0 epm7032s plcc 44 10.0 33.0 31.0 30.0 27.0 tqfp 14.0 46.0 44.0 43.0 40.0 epm7032v plcc 44 9.0 31.0 30.0 28.0 25.0 tqfp 14.0 45.0 44.0 42.0 39.0 EPM7032Ae plcc 44 9.0 31.0 30.0 28.0 25.0 tqfp 14.0 46.0 45.0 43.0 40.0 epm7064s plcc 44 9.0 31.0 30.0 28.0 25.0 tqfp 14.0 46.0 44.0 43.0 40.0 plcc 84 9.0 28.0 26.0 25.0 23.0 tqfp 100 11.0 39.0 37.0 35.0 32.0 epm7064 plcc 44 9.0 31.0 30.0 28.0 25.0 tqfp 13.0 44.0 43.0 41.0 38.0 plcc 84 9.0 28.0 26.0 25.0 22.0 pqfp 100 6.0 33.0 32.0 31.0 30.0 epm7064ae epm7064b plcc 44 9.0 31.0 30.0 28.0 25.0 tqfp 14.0 46.0 45.0 43.0 40.0 ubga 49 23.0 56.0 53.0 51.0 47.0 tqfp 100 12.0 39.0 37.0 35.0 31.0 fbga 21.0 49.0 47.0 44.0 40.0 epm7096 plcc 68 9.0 29.0 27.0 26.0 23.0 plcc 84 9.0 28.0 26.0 24.0 22.0 epm7128a plcc 84 9.0 28.0 26.0 25.0 22.0 tqfp 100 11.0 37.0 35.0 33.0 30.0 fbga 18.0 44.0 42.0 39.0 35.0 tqfp 144 9.0 31.0 29.0 28.0 25.0 fbga 256 12.0 38.0 36.0 34.0 31.0
package information datasheet for mature altera devices 31 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices epm7128b ubga 49 22.0 53.0 50.0 48.0 44.0 tqfp 100 11.0 38.0 36.0 34.0 31.0 fbga 19.0 46.0 44.0 41.0 37.0 tqfp 144 9.0 32.0 30.0 29.0 26.0 ubga 169 16.0 44.0 42.0 39.0 35.0 fbga 256 13.0 40.0 38.0 36.0 33.0 epm7128e plcc 84 10.0 29.0 28.0 26.0 23.0 pqfp 100 6.0 32.0 31.0 30.0 29.0 pqfp 160 6.0 32.0 31.0 30.0 28.0 epm7128s plcc 84 10.0 30.0 28.0 26.0 23.0 tqfp 100 12.0 38.0 36.0 34.0 30.0 pqfp 10.0 35.0 34.0 33.0 32.0 pqfp 160 7.0 33.0 32.0 31.0 30.0 epm7128ae plcc 84 11.0 30.0 28.0 26.0 23.0 tqfp 100 12.0 38.0 36.0 34.0 30.0 fbga 14.0 43.0 40.0 38.0 37.0 tqfp 144 11.0 33.0 30.0 28.0 26.0 ubga 169 14.0 42.0 40.0 38.0 36.0 fbga 256 12.0 39.0 37.0 35.0 31.0 epm7160e plcc 84 10.0 29.0 28.0 26.0 23.0 pqfp 100 6.0 32.0 31.0 30.0 29.0 pqfp 160 6.0 33.0 32.0 31.0 30.0 epm7160s plcc 84 10.0 35.0 28.0 26.0 23.0 tqfp 100 12.0 37.0 35.0 33.0 30.0 pqfp 160 6.0 33.0 32.0 31.0 30.0 epm7192s pqfp 160 6.0 32.0 31.0 30.0 29.0 epm7192e pga 160 6.0 20.0 13.0 10.0 8.0 pqfp 6.0 32.0 31.0 30.0 26.0 epm7256a tqfp 100 9.0 36.0 34.0 32.0 30.0 tqfp 144 8.0 32.0 27.0 25.0 24.0 pqfp 208 5.0 30.0 28.0 26.0 21.0 fbga 256 12.0 34.0 32.0 29.0 28.0 epm7256b tqfp 100 12.0 37.0 35.0 33.0 30.0 tqfp 144 9.0 33.0 29.0 27.0 25.0 ubga 169 13.0 40.0 38.0 36.0 34.0 pqfp 208 5.0 31.0 29.0 27.0 22.0 fbga 256 9.0 34.0 32.0 30.0 28.0 table 32. thermal resistance of max 7000 devices (part 2 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min.
32 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation epm7256e pga 192 6.0 20.0 13.0 10.0 8.0 pqfp 160 6.0 31.0 30.0 29.0 25.0 rqfp 208 1.0 17.0 16.0 15.0 13.0 epm7256s pqfp 208 5.0 30.0 29.0 26.0 21.0 rqfp 1.0 18.0 17.0 16.0 15.0 epm7256ae fbga 100 13.0 42.0 39.0 37.0 36.0 tqfp 100 12.0 37.0 35.0 33.0 30.0 tqfp 144 9.0 33.0 29.0 27.0 25.0 pqfp 208 5.0 31.0 29.0 27.0 22.0 fbga 256 9.0 34.0 32.0 30.0 28.0 epm7512ae tqfp 144 10.0 32.0 27.0 25.0 23.0 pqfp 208 5.0 30.0 28.0 25.0 21.0 bga 256 1.2 14.0 12.0 11.0 10.0 fbga 11.0 32.0 30.0 28.0 22.0 epm7512b tqfp 144 10.0 32.0 27.0 25.0 24.0 ubga 169 12.0 35.0 33.0 31.0 30.0 pqfp 208 5.0 30.0 28.0 25.0 21.0 bga 256 1.2 14.0 12.0 11.0 10.0 fbga 256 11.0 32.0 30.0 28.0 27.0 table 32. thermal resistance of max 7000 devices (part 3 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min.
package information datasheet for mature altera devices 33 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices max 3000a devices table 33 lists the thermal resistance of max 3000a devices. hardcopy series devices thermal resistance table 34 to table 35 provide thermal resistance values for hardcopy series devices. table 33. thermal resistance of max 3000a devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epm3032a tqfp 44 14.0 46.0 45.0 43.0 40.0 plcc 9.0 31.0 30.0 28.0 25.0 epm3064a tqfp 44 14.0 46.0 45.0 43.0 40.0 plcc 9.0 31.0 30.0 28.0 25.0 tqfp 100 12.0 39.0 37.0 35.0 31.0 epm3128a tqfp 100 12.0 38.0 36.0 34.0 30.0 epm3256a tqfp 144 9.0 33.0 29.0 27.0 25.0 pqfp 208 5.0 31.0 29.0 27.0 22.0 epm3512a pqfp 208 5.0 30.0 28.0 25.0 21.0 fbga 256 11.0 32.0 30.0 28.0 22.0
34 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation hardcopy ii devices table 34 lists the thermal resistance of hardcopy ii devices. hardcopy devices table 35 lists the thermal resistance of hardcopy devices. table 34. thermal resistance of hardcopy ii devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ? jb ( c/w) hc210 fbga, wire bond 484 5.5 21.3 17.4 15.3 13.8 9.6 hc220 fbga, flip chip 672 0.5 12.1 9.9 8.3 7.1 3.6 fbga, flip chip 780 0.5 11.7 9.5 8.0 6.8 3.5 hc230 fbga, flip chip 1020 0.3 10.8 8.6 7.1 6.0 2.9 hc240 fbga, flip chip 1020 0.2 10.6 8.4 6.9 5.8 2.7 fbga, flip chip 1508 0.2 9.7 7.5 6.1 5.0 2.6 table 35. thermal resistance of hardcopy devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. hc20k400 bga, flip chip 652 0.5 9.1 7.9 6.4 5.3 hc20k600 fbga, flip chip 672 1.0 13.0 10.2 8.6 7.3 hc1s25 fbga, wire bond 672 3.7 19.7 15.8 13.9 12.4 bga, wire bond 3.4 19.3 15.6 13.8 12.3 hc1s30 fbga, flip chip 780 0.4 10.9 8.8 7.4 6.3 hc1s40 fbga, flip chip 780 0.4 10.9 8.8 7.4 6.3 hc1s60 fbga, flip chip 1020 0.3 10.3 8.54 7.0 5.8 hc1s80 fbga, flip chip 1020 0.3 10.3 8.54 7.0 5.8
package information datasheet for mature altera devices 35 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices apex series devices thermal resistance table 36 to table 37 list thermal resistance values for apex series devices. apex ii devices table 36 lists the thermal resistance of apex ii devices. table 36. thermal resistance of apex ii devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep2a15 fbga, flip chip (cu lid) 672 0.2 10.8 8.8 7.4 6.2 fbga, flip chip (alsic lid) 0.3 11.6 9.6 8.0 6.6 bga, flip chip (cu lid) 724 0.2 9.7 7.7 6.4 5.3 bga, flip chip (alsic lid) 0.4 10.0 8.2 6.6 5.4 ep2a25 fbga (cu lid) 672 0.2 10.7 8.7 7.2 6.1 fbga, flip chip (alsic lid) 0.3 11.5 9.6 8.0 6.6 bga, flip chip (cu lid) 724 0.2 9.6 7.6 6.2 5.2 bga, flip chip (alsic lid) 0.3 10.0 8.2 6.6 5.4 fbga, flip chip (cu lid) 1020 0.2 9.8 7.8 6.4 5.3 fbga, flip chip (alsic lid) 0.3 10.4 8.5 6.9 5.7 ep2a40 fbga, flip chip (cu lid) 672 0.2 10.0 8.2 6.9 5.9 fbga, flip chip (alsic lid) 0.2 10.0 8.2 6.9 5.9 bga, flip chip (cu lid) 724 0.2 9.5 7.5 6.1 5.1 bga, flip chip (alsic lid) 0.2 9.5 7.5 6.1 5.1 fbga, flip chip (cu lid) 1020 0.2 9.7 7.7 6.3 5.2 fbga, flip chip (alsic lid) 0.2 9.7 7.7 6.3 5.2 ep2a70 bga, flip chip (cu lid) 724 0.1 9.3 7.3 6.0 4.9 bga, flip chip (alsic lid) 0.1 10.0 7.9 6.4 5.3 fbga, flip chip (cu lid) 1508 0.1 8.8 6.8 5.5 4.5 fbga, flip chip (alsic lid) 0.1 9.3 7.3 5.8 4.7
36 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation apex 20k devices table 37 lists the thermal resistance of apex 20ke, 20kc, and 20k devices. table 37. thermal resistance of apex 20ke, 20kc, and 20k devices (part 1 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep20k30e tqfp 144 8.0 29.0 28.0 26.0 25.0 pqfp 208 5.0 30.0 29.0 27.0 22.0 fbga 144 14.0 36.0 34.0 32.0 29.0 fbga 324 9.0 31.0 29.0 28.0 25.0 ep20k60e tqfp 144 7.0 28.0 26.0 25.0 24.0 fbga 144 11.0 33.0 32.0 30.0 27.0 pqfp 208 5.0 30.0 28.0 26.0 21.0 pqfp 240 4.0 26.0 24.0 21.0 17.0 fbga 324 7.0 29.0 28.0 26.0 24.0 bga 356 1.0 12.0 11.0 10.0 9.0 ep20k100 tqfp 144 7.0 26.0 25.0 24.0 23.0 pqfp 208 5.0 29.0 27.0 25.0 20.0 pqfp 240 4.0 25.0 23.0 20.0 17.0 fbga 324 6.0 28.0 26.0 25.0 23.0 bga 356 1.0 12.0 11.0 10.0 9.0 ep20k100e tqfp 144 7.0 26.0 25.0 24.0 23.0 fbga 144 9.0 32.0 30.0 29.0 26.0 pqfp 208 5.0 29.0 27.0 25.0 20.0 pqfp 240 4.0 25.0 23.0 20.0 17.0 fbga 324 6.0 28.0 26.0 25.0 23.0 bga 356 1.0 12.0 11.0 10.0 9.0 ep20k160e tqfp 144 6.0 25.0 24.0 23.0 22.0 pqfp 208 5.0 28.0 26.0 23.0 19.0 pqfp 240 4.0 24.0 21.0 19.0 16.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 24.0 23.0 22.0 21.0 ep20k200 pqfp 208 4.0 25.0 23.0 20.0 17.0 pqfp 240 3.0 21.0 19.0 17.0 15.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 22.0 21.0 20.0 19.0 ep20k200e pqfp 208 4.0 25.0 23.0 20.0 17.0 pqfp 240 3.0 22.0 19.0 18.0 16.0 bga 356 2.0 12.0 11.0 10.0 9.0 fbga 484 5.0 23.0 22.0 21.0 20.0 bga 652 1.0 12.0 11.0 10.0 9.0 fbga 672 5.0 21.0 20.0 19.0 18.0
package information datasheet for mature altera devices 37 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices ep20k200c pqfp 208 4.0 25.0 23.0 20.0 17.0 pqfp 240 3.0 22.0 19.0 18.0 16.0 bga 356 2.0 12.0 11.0 10.0 9.0 fbga 484 5.0 23.0 22.0 21.0 20.0 ep20k300e pqfp 240 3.0 19.0 18.0 16.0 15.0 bga 652 1.0 12.0 11.0 10.0 9.0 fbga 672 5.0 20.0 19.0 18.0 17.0 ep20k400 bga 652 0.5 9.0 8.0 7.0 6.0 pga 655 1.0 8.0 7.0 6.0 4.0 fbga 672 0.4 11.6 9.6 7.9 6.5 fbga w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6 ep20k400e ep20k400c bga 652 0.5 9.0 8.0 7.0 6.0 fbga (cu lid) 672 0.3 10.9 8.8 7.4 6.3 fbga (alsic lid) 0.4 11.7 9.7 8.0 6.7 fbga w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6 ep20k600e ep20k600c bga 652 0.5 9.0 8.0 7.0 6.0 fbga (cu lid) 672 0.2 10.8 8.7 7.3 6.1 fbga (alsic lid) 0.3 11.6 9.6 7.9 6.5 fbga w/ fin (1) 672 0.5 5.0 3.0 3.0 2.0 fbga (cu lid) 1,020 0.2 9.9 7.8 6.5 5.4 fbga (alsic lid) 0.3 10.4 8.4 6.8 5.6 fbga w/ fin (1) 1,020 0.5 5.0 3.0 3.0 2.0 ep20k1000e ep20k1000c bga (cu lid) 652 0.1 8.3 7.0 5.6 4.5 bga (alsic lid) 0.2 9.3 7.4 6.0 4.9 fbga w/ fin (1) 652 0.5 4.0 3.0 3.0 2.0 fbga (cu lid) 672 0.1 10.6 8.6 7.2 6.0 fbga (alsic lid) 0.2 11.4 9.4 7.7 6.3 fbga w/ fin (1) 672 0.5 6.0 4.0 3.0 2.0 fbga (cu lid) 1,020 0.1 9.7 7.7 6.3 5.2 fbga (alsic lid) 0.2 10.2 8.2 6.6 5.4 fbga w/ fin (1) 1,020 0.5 5.0 3.0 2.0 2.0 table 37. thermal resistance of apex 20ke, 20kc, and 20k devices (part 2 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min.
38 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation acex 1k devices thermal resistance table 38 provides thermal resistance values for acex 1k devices. ep20k1500e bga (cu lid) 652 0.1 8.2 6.9 5.5 4.4 bga (alsic lid) 0.2 9.2 7.3 5.8 4.8 fbga 652 0.1 9.2 7.3 5.8 4.8 fbga w/ fin (1) 652 0.5 4.0 3.0 2.5 2.0 fbga (cu lid) 1,020 0.1 9.6 7.6 6.2 5.1 fbga (alsic lid) 0.2 10.1 8.1 6.4 5.3 fbga w/ fin (1) 1,020 0.5 5.0 3.0 2.5 2.0 note to table 37 : (1) ?fin? is an extra heat sink that customers can add to the device. several vendors make heat sinks, and they all have different sizes. altera performed the thermal calculations in table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base thickness: 0.5 mm. table 37. thermal resistance of apex 20ke, 20kc, and 20k devices (part 3 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. table 38. thermal resistance of acex 1k devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1k10 tqfp 100 11.0 37.0 35.0 33.0 29.0 tqfp 144 8.0 31.0 29.0 28.0 25.0 pqfp 208 6.0 30.0 29.0 27.0 22.0 fbga 256 12.0 37.0 35.0 33.0 30.0 ep1k30 tqfp 144 8.0 28.0 27.0 26.0 24.0 pqfp 208 5.0 30.0 28.0 26.0 21.0 fbga 256 9.0 31.0 29.0 28.0 25.0 ep1k50 tqfp 144 7.0 26.0 25.0 24.0 23.0 pqfp 208 5.0 29.0 28.0 25.0 20.0 fbga 256 7.0 30.0 28.0 27.0 24.0 fbga 484 5.0 25.0 24.0 23.0 22.0 ep1k100 pqfp 208 5.0 28.0 26.0 23.0 18.0 fbga 256 6.0 28.0 26.0 25.0 23.0 fbga 484 5.0 24.0 23.0 22.0 21.0
package information datasheet for mature altera devices 39 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices mercury devices thermal resistance table 39 provides thermal resistance values for mercury devices. flex series devices thermal resistance table 40 through table 42 provide thermal resistance values for flex series devices. flex 10k devices table 40 lists the thermal resistance of flex 10k devices. table 39. thermal resistance of mercury devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. ep1m120 fbga (cu lid) 484 0.6 12.2 10.1 8.7 7.5 fbga (alsic lid) 484 0.9 13.0 11.1 9.3 7.9 ep1m350 fbga (cu lid) 780 0.2 10.5 8.5 7.1 5.9 fbga (alsic lid) 780 0.3 11.0 9.2 7.6 6.3 table 40. thermal resistance of flex 10k devices (part 1 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epf10k10 plcc 84 9.0 28.0 26.0 24.0 22.0 tqfp 144 7.0 26.0 25.0 24.0 23.0 pqfp 208 5.0 29.0 27.0 25.0 20.0 epf10k10a tqfp 100 10.0 35.0 33.0 31.0 28.0 tqfp 144 7.0 29.0 28.0 26.0 25.0 pqfp 208 5.0 30.0 29.0 27.0 21.0 fbga 256 7.0 33.0 30.0 28.0 26.0 epf10k20 tqfp 144 6.0 24.0 23.0 22.0 21.0 rqfp 208 1.0 17.0 16.0 15.0 13.0 rqfp 240 1.0 14.0 12.0 11.0 10.0 epf10k30 rqfp 208 1.0 17.0 16.0 15.0 12.0 rqfp 240 1.0 13.0 12.0 11.0 10.0 bga 356 1.0 12.0 11.0 10.0 9.0 epf10k30a tqfp 144 7.0 25.0 24.0 23.0 22.0 pqfp 208 5.0 29.0 27.0 24.0 19.0 pqfp 240 4.0 25.0 22.0 20.0 17.0 fbga 256 6.0 28.0 26.0 24.0 23.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 24.0 22.0 21.0 20.0 epf10k30e tqfp 144 9.0 28.0 27.0 26.0 24.0 pqfp 208 5.0 30.0 28.0 26.0 21.0 fbga 256 9.0 31.0 29.0 28.0 25.0 fbga 484 6.0 26.0 25.0 24.0 22.0
40 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation epf10k40 rqfp 208 1.0 17.0 16.0 15.0 12.0 rqfp 240 1.0 13.0 12.0 11.0 10.0 epf10k50 rqfp 240 1.0 12.0 11.0 10.0 9.0 bga 356 1.0 12.0 11.0 10.0 9.0 pga 403 3.0 12.0 10.0 9.0 8.0 pga (1) 3.0 10.0 8.0 7.0 6.0 epf10k50v pqfp 240 4.0 25.0 22.0 20.0 17.0 rqfp 240 1.0 13.0 12.0 11.0 10.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 23.0 22.0 21.0 20.0 epf10k50e tqfp 144 9.0 26.0 25.0 24.0 23.0 pqfp 208 5.0 29.0 27.0 24.0 19.0 pqfp 240 4.0 25.0 22.0 20.0 17.0 fbga 256 6.0 29.0 27.0 26.0 24.0 fbga 484 5.0 25.0 24.0 23.0 21.0 epf10k50s tqfp 144 9.0 26.0 25.0 24.0 23.0 pqfp 208 5.0 29.0 28.0 25.0 20.0 pqfp 240 4.0 26.0 23.0 20.0 17.0 fbga 256 7.0 30.0 28.0 27.0 24.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 25.0 24.0 23.0 22.0 epf10k70 rqfp 240 1.0 12.0 11.0 10.0 9.0 pga 503 1.0 8.0 7.0 6.0 4.0 epf10k100 pga 503 1.0 8.0 7.0 6.0 4.0 pga (1) 1.0 6.0 5.0 4.0 3.0 pga (2) ? 2.0 ? ? ? epf10k100a rqfp 240 1.0 13.0 11.0 10.0 9.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 22.0 21.0 20.0 18.0 bga 600 0.5 10.0 9.0 8.0 7.0 epf10k100e pqfp 208 5.0 28.0 26.0 23.0 18.0 pqfp 240 4.0 23.0 21.0 19.0 16.0 fbga 256 6.0 28.0 26.0 25.0 23.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 24.0 23.0 22.0 21.0 epf10k130v pga 599 1.0 8.0 7.0 6.0 4.0 bga 600 0.5 10.0 9.0 8.0 7.0 table 40. thermal resistance of flex 10k devices (part 2 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min.
package information datasheet for mature altera devices 41 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices flex 8000 devices table 41 lists the thermal resistance of flex 8000 devices. epf10k130e pqfp 240 4.0 21.0 19.0 17.0 15.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 23.0 22.0 21.0 20.0 bga 600 0.5 10.0 9.0 8.0 7.0 fbga 672 5.0 21.0 20.0 19.0 18.0 epf10k200e pga 599 1.0 8.0 7.0 6.0 4.0 bga 600 0.5 10.0 9.0 8.0 7.0 fbga 672 5.0 20.0 19.0 18.0 17.0 epf10k200s rqfp 240 1.0 13.0 11.0 10.0 9.0 bga 356 1.0 12.0 11.0 10.0 9.0 fbga 484 5.0 22.0 21.0 20.0 19.0 bga 600 0.5 10.0 9.0 8.0 7.0 fbga 672 5.0 21.0 20.0 19.0 18.0 epf10k250a pga 599 1.0 8.0 7.0 6.0 4.0 bga 600 0.5 10.0 9.0 8.0 7.0 notes to table 40 : (1) with attached pin-fin heat sink. (2) with attached motor-driven fan heat sink. table 40. thermal resistance of flex 10k devices (part 3 of 3) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. table 41. thermal resistance of flex 8000 devices (part 1 of 2) device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epf8282a plcc 84 10.0 30.0 28.0 26.0 23.0 tqfp 100 11.0 36.0 34.0 32.0 29.0 epf8452a plcc 84 10.0 30.0 28.0 26.0 23.0 tqfp 100 11.0 35.0 33.0 31.0 28.0 pqfp 160 6.0 32.0 31.0 30.0 28.0 epf8636a plcc 84 10.0 29.0 28.0 26.0 23.0 pqfp 160 6.0 32.0 31.0 30.0 27.0 pga 192 6.0 16.0 11.0 8.0 6.0 pqfp 208 5.0 30.0 38.0 26.0 20.0 rqfp 208 1.0 17.0 16.0 15.0 14.0
42 package information datasheet for mature altera devices thermal resistance package information datasheet for mature altera devices ? december 2011 altera corporation flex 6000 devices table 42 lists the thermal resistance of flex 6000 devices. excalibur devices thermal resistance table 43 provides thermal resistance values for excalibur devices. device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epf8820a tqfp 144 9.0 26.0 25.0 24.0 23.0 pqfp 160 6.0 32.0 31.0 30.0 27.0 pqfp 208 5.0 29.0 27.0 25.0 20.0 rqfp 208 1.0 17.0 16.0 15.0 14.0 bga 225 6.0 28.0 19.0 14.0 11.0 epf81188a pqfp 208 5.0 28.0 26.0 24.0 19.0 pga 232 2.0 14.0 10.0 7.0 5.0 pqfp 240 4.0 24.0 21.0 19.0 16.0 rqfp 240 1.0 14.0 12.0 11.0 10.0 epf81500a pqfp 240 4.0 22.0 20.0 19.0 16.0 rqfp 240 1.0 13.0 12.0 11.0 10.0 pga 280 2.0 14.0 10.0 7.0 5.0 table 41. thermal resistance of flex 8000 devices (part 2 of 2) table 42. thermal resistance of flex 6000 devices device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epf6010a tqfp 100 11.0 35.0 33.0 31.0 28.0 tqfp 144 10.0 28.0 26.0 25.0 24.0 epf6016 tqfp 144 10.0 28.0 26.0 25.0 24.0 pqfp 208 5.0 30.0 28.0 26.0 21.0 pqfp 240 4.0 26.0 24.0 21.0 17.0 bga 256 6.0 28.0 22.0 20.0 19.0 epf6016a tqfp 100 11.0 35.0 33.0 31.0 28.0 fbga 14.0 36.0 34.0 32.0 29.0 tqfp 144 10.0 29.0 28.0 26.0 24.0 pqfp 208 5.0 30.0 29.0 26.0 21.0 fbga 256 10.0 32.0 30.0 29.0 26.0 epf6024a tqfp 144 10.0 27.0 26.0 25.0 24.0 pqfp 208 5.0 29.0 28.0 26.0 20.0 pqfp 240 4.0 26.0 23.0 21.0 17.0 bga 256 6.0 28.0 22.0 20.0 19.0 fbga 8.0 30.0 29.0 27.0 25.0
package information datasheet for mature altera devices 43 thermal resistance ? december 2011 altera corporation package information datasheet for mature altera devices table 43. thermal resistance of excalibur embedded processor solutions device package pin count ? jc ( c/w) ? ja ( c/w) still air ? ja ( c/w) 100 ft./min. ? ja ( c/w) 200 ft./min. ? ja ( c/w) 400 ft./min. epxa1 fbga 484 4.0 20.0 18.3 15.8 13.9 fbga, flip chip (cu lid) 672 0.5 11.3 9.3 7.9 6.7 fbga, flip chip (alsic lid) 672 0.8 12.2 10.2 8.6 7.2 epxa4 fbga, flip chip (cu lid) 672 0.2 10.8 8.8 7.3 6.2 fbga, flip chip (alsic lid) 672 0.3 11.6 9.6 7.9 6.6 fbga, flip chip (cu lid) 1,020 0.2 9.9 7.9 6.5 5.4 fbga, flip chip (alsic lid) 1,020 0.3 10.4 8.5 6.9 5.7 epxa10 fbga, flip chip (cu lid) 1,020 0.1 9.6 7.6 6.2 5.1 fbga, flip chip (alsic lid) 1,020 0.2 10.0 8.0 6.4 5.7
44 package information datasheet for mature altera devices package outlines package information datasheet for mature altera devices ? december 2011 altera corporation package outlines the package outlines on the following pages are listed in order of ascending pin count. altera package outlines meet the requirements of jedec publication no. 95 . 1 all lidless flip chip and wire bond packages are non-vented packages. all other flip chip packages are vented packages.
package information datasheet for mature altera devices 45 ? december 2011 altera corporation package information datasheet for mature altera devices 8-pin plastic dual in-line package (pdip)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in inches. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference p package acronym pdip leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-001 variation: ba lead coplanarity na weight 0.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a ? ? 0.170 a1 0.015 ? ? a2 0.130 typ d 0.360 ? 0.380 e 0.300 0.310 0.325 e1 0.240 0.250 0.260 l 0.125 ? 0.135 b 0.016 0.018 0.020 c 0.008 0.010 0.014 e 0.100 bsc
46 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline e1 d a a2 a1 b e l c e pin 1 id pin 1 pin 4 pin 8
package information datasheet for mature altera devices 47 ? december 2011 altera corporation package information datasheet for mature altera devices 20-pin plastic j-lead chip carrier (plcc)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin 1 is generally indicated by an indentation in the plastic body, in pin 1's proximity, on package surface. package information description specification ordering code reference l package acronym plcc leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-018 variation: aa lead coplanarity 0.004 inches (0.10mm) weight 0.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a 0.165 0.172 0.180 a1 0.020 ? ? a2 0.150 typ d 0.385 0.390 0.395 d1 0.350 0.353 0.356 d2 0.290 0.310 0.330 e 0.385 0.390 0.395 e1 0.350 0.353 0.356 e2 0.290 0.310 0.330 b 0.013 ? 0.021 c 0.010 typ e 0.050 typ
48 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 49 ? december 2011 altera corporation package information datasheet for mature altera devices 32-pin plastic thin quad flat pack (tqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference t package acronym tqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: aba lead coplanarity 0.004 inches (0.1mm) weight 0.2 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.20 a1 0.05 ? 0.15 a2 0.95 1.00 1.05 d 9.00 bsc d1 7.00 bsc e 9.00 bsc e1 7.00 bsc l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ? ? b 0.30 0.37 0.45 c 0.09 ? 0.20 e 0.80 bsc ? 0? 3.5? 7?
50 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 51 ? december 2011 altera corporation package information datasheet for mature altera devices 44-pin plastic j-lead chip carrier (plcc)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in inches. pin 1 is generally indicated by an indentation in the plastic body, in pin 1?s proximity, on package surface. package information description specification ordering code reference l package acronym plcc leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-018 variation: ac lead coplanarity 0.004 inches (0.10 mm) weight 2.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a 0.165 0.172 0.180 a1 0.020 ? ? a2 0.150 typ d 0.685 0.690 0.695 d1 0.650 0.653 0.656 d2 0.582 0.610 0.638 e 0.685 0.690 0.695 e1 0.650 0.653 0.656 e2 0.582 0.610 0.638 b 0.013 ? 0.021 c 0.010 typ e 0.050 typ
52 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d1 a a2 a1 e1 e d pin 1 id c e b d2 e2 pin 7 pin 17 pin 44 pin 1
package information datasheet for mature altera devices 53 ? december 2011 altera corporation package information datasheet for mature altera devices 44-pin plastic thin quad flat pack (tqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference t package acronym tqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: acb lead coplanarity 0.004 inches (0.1mm) weight 0.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.20 a1 0.05 ? 0.15 a2 0.95 ? ? d 12.00 bsc d1 10.00 bsc e 12.00 bsc e1 10.00 bsc l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ? ? b 0.30 0.37 0.45 c 0.09 ? 0.20 e 0.80 bsc ? 0? 3.5? 7?
54 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 55 ? december 2011 altera corporation package information datasheet for mature altera devices 49-pin ultra fineline ball-grid array (ubga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference u package acronym ubga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-216 variation: bab-2 lead coplanarity 0.005 inches (0.12mm) weight 0.2 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.55 a1 0.20 ? ? a2 ? ? 1.35 a3 0.70 typ d 7.00 bsc e 7.00 bsc b 0.40 0.50 0.60 e 0.80 bsc
56 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 57 ? december 2011 altera corporation package information datasheet for mature altera devices 64-pin plastic enhanced quad flat pack (eqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference e package acronym eqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: abd-hd lead coplanarity 0.003 inch (0.08 mm) weight 0.15 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.20 a1 0.05 ? 0.15 a2 0.95 1.00 1.05 d 9.00 bsc d1 7.00 bsc d2 3.50 4.50 5.50 e 9.00 bsc e1 7.00 bsc e2 3.50 4.50 5.50 l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ?? b 0.13 0.18 0.23 c 0.09 ? 0.20 e 0.40 bsc ? 0 3.5 7
58 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline pin 1 id pin 1 pin 16 pin 64 pin 64 pin 16 pin 1 detail a see detail a top view bottom view
package information datasheet for mature altera devices 59 ? december 2011 altera corporation package information datasheet for mature altera devices 84-pin plastic j-lead chip carrier (plcc)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin 1 is generally indicated by an indentation in the plastic body, in pin 1's proximity, on package surface. package information description specification ordering code reference l package acronym plcc leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-018 variation: af lead coplanarity 0.004 inches (0.10mm) weight 7.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a 0.165 0.172 0.180 a1 0.020 ? ? a2 0.150 typ d 1.185 1.190 1.195 d1 1.150 1.154 1.158 d2 1.082 1.110 1.138 e 1.185 1.190 1.195 e1 1.150 1.154 1.158 e2 1.082 1.110 1.138 b 0.013 ? 0.021 c 0.008 typ e 0.050 typ
60 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 61 ? december 2011 altera corporation package information datasheet for mature altera devices 88-pin ultra fineline ball-grid array (ubga)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference u package acronym ubga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline mo-219 lead coplanarity 0.005 inches (0.12 mm) weight 0.4 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.40 a1 0.25 ? ? a2 0.80 ? ? a3 0.70 ref d 11.00 bsc e 8.00 bsc b 0.40 0.45 0.50 e 0.80 bsc
62 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a1 a3 pin a1 id a a2 e e d a b e e g f c d b 1 6 75 4 3 2 pin a1 corner h 12 11 10 9 8 bottom view top view
package information datasheet for mature altera devices 63 ? december 2011 altera corporation package information datasheet for mature altera devices 100-pin fineline ball-grid array (fbga), option 1?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on the package surface. 1 this pod is applicable to f100 packages of all products except max ii, which is assembled in option 2 package outlines. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: aac-1 lead coplanarity 0.008 inches (0.20mm) weight 0.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.70 a1 0.30 ? ? a2 0.25 ? 1.10 a3 ? ? 0.80 d 11.00 bsc e 11.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
64 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e e a3 a1 a2 a pin a1 corner top view bottom view
package information datasheet for mature altera devices 65 ? december 2011 altera corporation package information datasheet for mature altera devices 100-pin plastic quad flat pack (pqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on the package surface. package information description specification ordering code reference q package acronym pqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-022 variation: gc-1 lead coplanarity 0.004 inches (0.10mm) weight 1.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.40 a1 0.25 ? 0.50 a2 2.50 2.70 2.90 d 17.20 bsc d1 14.00 bsc e 23.20 bsc e1 20.00 bsc l 0.73 0.88 1.03 l1 1.60 ref s 0.20 ? ? b 0.22 ? 0.40 c 0.11 ? 0.23 e 0.65 bsc ? 0? ?7 ?
66 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline e 0.25mm l l1 b e see detail a a1 detail a c s a2 a gage plane d1 d e1 pin 100 pin 30 pin 1 pin 1 id
package information datasheet for mature altera devices 67 ? december 2011 altera corporation package information datasheet for mature altera devices 100-pin plastic thin quad flat pack (tqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference t package acronym tqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: aed lead coplanarity 0.003 inches (0.08mm) weight 0.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.20 a1 0.05 ? 0.15 a2 0.95 1.00 1.05 d 16.00 bsc d1 14.00 bsc e 16.00 bsc e1 14.00 bsc l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ? ? b 0.17 0.22 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 7?
68 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 69 ? december 2011 altera corporation package information datasheet for mature altera devices 144-pin plastic enhanced quad flat pack (eqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference e package acronym eqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: bfb lead coplanarity 0.003 inches (0.08mm) weight 1.1 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.60 a1 0.05 ? 0.15 a2 1.35 1.40 1.45 d 22.00 bsc d1 20.00 bsc d2 4.00 ? ? e 22.00 bsc e1 20.00 bsc e2 4.00 ? ? l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ? ? b 0.17 0.22 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 7?
70 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 71 ? december 2011 altera corporation package information datasheet for mature altera devices 144-pin fineline ball-grid array (fbga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: aad-1 lead coplanarity 0.008 inches (0.20mm) weight 0.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.20 a1 0.30 ? ? a2 0.25 ? 1.80 a3 0.70 ref d 13.00 bsc e 13.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
72 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 73 ? december 2011 altera corporation package information datasheet for mature altera devices 144-pin plastic thin quad flat pack (tqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference t package acronym tqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-026 variation: bfb lead coplanarity 0.003 inches (0.08mm) weight 1.1 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.60 a1 0.05 ? 0.15 a2 1.35 1.40 1.45 d 22.00 bsc d1 20.00 bsc e 22.00 bsc e1 20.00 bsc l 0.45 0.60 0.75 l1 1.00 ref s 0.20 ? ? b 0.17 0.22 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 7?
74 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 75 ? december 2011 altera corporation package information datasheet for mature altera devices 160-pin ceramic pin-grid array (pga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference g package acronym pga leadframe material alloy 42 lead finish gold over nickel plate jedec outline reference mo-067 variation: ag lead coplanarity n/a weight 19.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a 0.160 0.190 0.220 a1 0.050 typ a2 0.120 0.140 0.160 d 1.540 1.560 1.580 e 1.540 1.560 1.580 l 0.130 typ b 0.016 0.018 0.020 e 0.100 bsc
76 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 77 ? december 2011 altera corporation package information datasheet for mature altera devices 160-pin plastic quad flat pack (pqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference q package acronym pqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-022 variation: dd-1 lead coplanarity 0.004 inches (0.10mm) weight 6.2 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 4.10 a1 0.25 ? 0.50 a2 3.20 3.40 3.60 d 31.20 bsc d1 28.00 bsc e 31.20 bsc e1 28.00 bsc l 0.50 ? 1.03 l1 1.60 ref s 0.20 ? ? b 0.22 ? 0.40 c 0.09 ? 0.23 e 0.65 bsc ? 0? ?7 ?
78 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 79 ? december 2011 altera corporation package information datasheet for mature altera devices 169-pin ultra fineline ball-grid array (ubga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference u package acronym ubga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-216 variation: baf-1 lead coplanarity 0.005 inches (0.12mm) weight 0.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.70 a1 0.20 ? ? a2 0.65 ? ? a3 0.70 typ d 11.00 bsc e 11.00 bsc b 0.40 0.50 0.60 e 0.80 bsc
80 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 81 ? december 2011 altera corporation package information datasheet for mature altera devices 208-pin plastic quad flat pack (pqfp)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot in its proximity on package surface. package information description specification ordering code reference q package acronym pqfp lead material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-029 variation: fa-1 lead coplanarity 0.003 inches (0.08 mm) weight 6.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 4.10 a1 0.25 ? 0.50 a2 3.20 3.40 3.60 d 30.60 bsc d1 28.00 bsc e 30.60 bsc e1 28.00 bsc l 0.50 0.60 0.75 l1 1.30 ref s 0.20 ? ? b 0.17 ? 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0 3.5 8
82 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline pin 1 id e d1 d pin 208 a a2 a1 s l l1 detail a gage plane 0.25mm c b e see detail a e1 pin 1 pin 52
package information datasheet for mature altera devices 83 ? december 2011 altera corporation package information datasheet for mature altera devices 208-pin power quad flat pack (rqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference r package acronym rqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-029 variation: fa-1 lead coplanarity 0.003 inches (0.08mm) weight 11.0 g (typ.) or 6.4 g (typ.) (1) moisture sensitivity level printed on moisture barrier bag note: (1) the lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized aluminum). refer to pcn1002. package outline dimension table symbol millimeters min. nom. max. a ? ? 4.10 a1 0.25 ? 0.50 a2 3.20 3.40 3.60 d 30.60 bsc d1 28.00 bsc e 30.60 bsc e1 28.00 bsc l 0.45 0.60 0.75 l1 1.30 ref s 0.20 ? ? b 0.17 ? 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 8?
84 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 85 ? december 2011 altera corporation package information datasheet for mature altera devices 240-pin plastic quad flat pack (pqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference q package acronym pqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-029 variation: ga lead coplanarity 0.003 inches (0.08mm) weight 8.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 4.10 a1 0.25 ? 0.50 a2 3.20 3.40 3.60 d 34.60 bsc d1 32.00 bsc e 34.60 bsc e1 32.00 bsc l 0.45 0.60 0.75 l1 1.30 ref s 0.20 ? ? b 0.17 ? 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 8?
86 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 87 ? december 2011 altera corporation package information datasheet for mature altera devices 240-pin power quad flat pack (rqfp)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin 1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference r package acronym rqfp leadframe material copper lead finish (plating) regular: 85sn:15pb (typ.) pb-free: matte sn jedec outline reference ms-029 variation: ga lead coplanarity 0.003 inches (0.08mm) weight 15.4 g (typ.) or 8.5 g (typ.) (1) moisture sensitivity level printed on moisture barrier bag note: (1) the lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized aluminum). refer to pcn1002. package outline dimension table symbol millimeters min. nom. max. a ? ? 4.10 a1 0.25 ? 0.50 a2 3.20 3.40 3.60 d 34.60 bsc d1 32.00 bsc e 34.60 bsc e1 32.00 bsc l 0.45 0.60 0.75 l1 1.30 ref s 0.20 ? ? b 0.17 ? 0.27 c 0.09 ? 0.20 e 0.50 bsc ? 0? 3.5? 8?
88 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 89 ? december 2011 altera corporation package information datasheet for mature altera devices 256-pin ball-grid array (bga), option 1?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt or tape solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: bal-2 lead coplanarity 0.008 inches (0.20 mm) weight 4.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.70 a1 0.35 ? ? a2 0.25 ? 1.10 d 27.00 bsc e 27.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
90 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e a1 a2 pin a1 corner a 12 n d c a b 1 j g e h f l k m u r t p w y v 7 4 3 2 5 6 10 8 9 11 18 15 14 13 16 17 20 19 e bottom view top view
package information datasheet for mature altera devices 91 ? december 2011 altera corporation package information datasheet for mature altera devices 256-pin plastic ball-grid array (bga), option 2?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: bal-2 lead coplanarity 0.008 inches (0.20 mm) weight 2.2 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.60 a1 0.35 ? ? a2 ? ? 2.20 a3 ? ? 1.80 d 27.00 bsc e 27.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
92 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e e a1 a2 pin a1 corner a w y v u r t p l n m k j 20 19 10 18 17 16 15 12 13 14 11 8 97 6 5 4 3 2 f h g e d a b c 1 top view bottom view a3
package information datasheet for mature altera devices 93 ? december 2011 altera corporation package information datasheet for mature altera devices 256-pin fineline ball-grid array (fbga), option 1?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. 1 this pod is applicable to f256 packages of all products listed in this datasheet except cyclone ii, which are assembled in option 2 package outlines. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aaf-1 lead coplanarity 0.008 inches (0.20 mm) weight 1.5 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.20 a1 0.30 ? ? a2 ? ? 1.80 a3 0.70 ref d 17.00 bsc e 17.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
94 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e e a3 a1 a2 a pin a1 corner bottom view top view
package information datasheet for mature altera devices 95 ? december 2011 altera corporation package information datasheet for mature altera devices 256-pin fineline ball-grid array (fbga), option 2?thin?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on the package surface. 1 this pod is applicable to f256 packages of the cyclone ii devices only. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: daf-1 lead coplanarity 0.008 inches (0.20 mm) weight 1.5 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.55 a1 0.25 ? ? a2 1.05 ref a3 ? ? 0.80 d 17.00 bsc e 17.00 bsc b 0.45 0.50 0.55 e 1.00 bsc
96 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 97 ? december 2011 altera corporation package information datasheet for mature altera devices 324-pin fineline ball-grid array (fbga)?wire bond?option 1 all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aag-1 lead coplanarity 0.008 inches (0.20mm) weight 1.4 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.20 a1 0.30 ? ? a2 ? ? 1.80 a3 0.70 ref d 19.00 bsc e 19.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
98 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 99 ? december 2011 altera corporation package information datasheet for mature altera devices 356-pin ball-grid array (bga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt or tape solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: bar-2 lead coplanarity 0.008 inches (0.20mm) weight 7.7 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 1.70 a1 0.35 ? ? a2 0.25 ? 1.10 d 35.00 bsc e 35.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
100 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 101 ? december 2011 altera corporation package information datasheet for mature altera devices 400-pin fineline ball-grid array (fbga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aah-1 lead coplanarity 0.008 inches (0.20mm) weight 2.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeteres min. nom. max. a ? ? 2.20 a1 0.30 ? ? a2 ? ? 1.80 a3 0.80 ref d 21.00 bsc e 21.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
102 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e e a3 a1 a2 a pin a1 corner bottom view top view
package information datasheet for mature altera devices 103 ? december 2011 altera corporation package information datasheet for mature altera devices 403-pin ceramic pin-grid array (pga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference g package acronym pga leadframe material alloy 42 lead finish gold over nickel plate jedec outline reference mo-128 variation: al lead coplanarity n/a weight 47.7 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a 0.157 0.180 0.203 a1 0.050 typ a2 0.117 0.130 0.143 d 1.940 1.960 1.980 e 1.940 1.960 1.980 l 0.130 typ b 0.016 0.018 0.020 e 0.100 bsc
104 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 105 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on the package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aaj-1 lead coplanarity 0.008 inches (0.20 mm) weight 6.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 23.00 bsc e 23.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
106 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d a1 a3 a2 a e e e b pin a1 id pin a1 corner bottom view top view
package information datasheet for mature altera devices 107 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin fineline ball-grid array (fbga), option 1?flip chip?channel lid all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on the package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-034 variation: aaj-1 lead coplanarity 0.008 inches (0.20 mm) weight 6.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a 2.95 3.15 3.35 a1 0.40 0.50 0.60 a2 2.35 2.65 2.95 a3 1.35 1.45 1.55 d 23.00 bsc e 23.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
108 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d a1 a3 a2 a e e e b pin a1 id pin a1 corner bottom view top view
package information datasheet for mature altera devices 109 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin fineline ball-grid array (fbga), option 2?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition r egular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aaj-1 lead coplanarity 0.008 inches (0.20 mm) weight 2.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.60 a1 0.30 ? ? a2 ? ? 2.20 a3 ? ? 1.80 d 23.00 bsc e 23.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
110 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline bottom view top view e e d e pin a1 id b a3 a1 a2 a pin a1 corner
package information datasheet for mature altera devices 111 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin fineline ball-grid array (fbga), option 4?flip chip all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition r egular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aaj-1 lead coplanarity 0.008 inches (0.20 mm) weight 5.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 23.00 bsc d1 17.00 bsc e 23.00 bsc e1 17.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
112 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 113 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin fineline ball-grid array (fbga)?wire bond?a:2.40 all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition r egular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aaj-1 lead coplanarity 0.008 inches (0.20 mm) weight 2.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a 2.10 2.25 2.40 a1 0.40 0.50 0.60 a2 1.50 1.75 2.00 a3 1.12 1.17 1.22 d 23.00 bsc e 23.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
114 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a3 a1 a2 a
package information datasheet for mature altera devices 115 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin hybrid fineline ball-grid array (hbga)?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference h package acronym hbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aal-1 lead coplanarity 0.008 inches (0.20mm) weight 11.3 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 27.00 bsc e 27.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
116 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline bottom view top view e d e e a1 a2 b a3 a pin a1 id pin a1 corner
package information datasheet for mature altera devices 117 ? december 2011 altera corporation package information datasheet for mature altera devices 484-pin ultra fineline ball-grid array (ubga)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference u package acronym ubga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-216 variation: bap-2 lead coplanarity 0.005 inches (0.12mm) weight 1.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.20 a1 0.20 ? ? a2 0.65 ? ? a3 0.95 typ d 19.00 bsc e 19.00 bsc b 0.40 0.50 0.60 e 0.80 bsc
118 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline bottom view top view d e pin a1 id b a3 a1 a2 a pin a1 corner e e
package information datasheet for mature altera devices 119 ? december 2011 altera corporation package information datasheet for mature altera devices 503-pin ceramic pin-grid array (pga)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in inches. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference g package acronym pga leadframe material alloy 42 lead finish gold over nickel plate jedec outline reference mo-128 variation: an lead coplanarity n/a weight 59.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a ? ? 0.205 a1 0.050 typ a2 ? ? 0.145 d 2.245 2.260 2.275 e 2.245 2.260 2.275 l 0.130 typ b 0.016 0.018 0.020 e 0.100 bsc
120 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d pin a1 id e a1 a a2 l l w aa r u n g j e c a 19 15 11 7 3 21 17 13 9 5 1 23 29 27 25 ag aj ae ac 3133 an al 37 35 au ar 36 34 32 28 30 26 22 24 20 16 18 14 10 12 8 4 62 v am at ap ah ak af ab ad y k p t m h d f b 40 3941 38 43 42 bb bc aw ba av ay top view bottom view b e e pin a1 corner 1 2 e 1 2 e
package information datasheet for mature altera devices 121 ? december 2011 altera corporation package information datasheet for mature altera devices 599-pin ceramic pin-grid array (pga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference g package acronym pga leadframe material alloy 42 lead finish gold over nickel plate jedec outline reference mo-128 variation: ap lead coplanarity n/a weight 69.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a ? ? 0.205 a1 0.050 typ a2 ? ? 0.145 d 2.445 2.460 2.475 e 2.445 2.460 2.475 l 0.130 typ b 0.016 0.018 0.020 e 0.100 bsc
122 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 123 ? december 2011 altera corporation package information datasheet for mature altera devices 600-pin ball-grid array (bga)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt or tape solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: baw-1 lead coplanarity 0.008 inches (0.20mm) weight 12.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.00 a1 0.35 ? ? a2 0.25 ? 1.10 d 45.00 bsc e 45.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
124 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b e e a1 a2 pin a1 corner a 34 12 ak n d c a b 1 j g e h f l k m aj ag ae ac aa u r t p w y v ah ad af ab 7 4 3 2 5 6 10 8 9 11 ar an al ap am 24 23 18 15 14 13 16 17 20 21 19 22 29 26 25 28 27 32 30 31 33 35 top view bottom view
package information datasheet for mature altera devices 125 ? december 2011 altera corporation package information datasheet for mature altera devices 652-pin ball-grid array (bga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: baw-1 lead coplanarity 0.008 inches (0.20 mm) weight 23.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 45.00 bsc e 45.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
126 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline 17 10 11 12 13 ad ag ah af ae aa ab ac y w n u v t p r k m l j h 6 7 8 9 2 3 4 5 b f g e d c 1 a aj ar am an ap ak al 34 35 30 31 32 33 28 29 26 27 22 23 24 25 18 19 20 21 14 15 16 d e e b e a1 a3 a2 a pin a1 id pin a1 corner bottom view top view
package information datasheet for mature altera devices 127 ? december 2011 altera corporation package information datasheet for mature altera devices 652-pin plastic ball-grid array (bga), option 2?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: baw-1 lead coplanarity 0.008 inches (0.20 mm) weight 15.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.20 a1 0.35 ? ? a2 ? ? 2.80 a3 ? ? 2.40 d 45.00 bsc e 45.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
128 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a3 top view bottom view 28 29 26 27 22 23 24 25 18 19 20 21 14 15 16 17 10 11 12 13 ad ag ah af ae aa ab ac y w n u v t p r k m l j h 6 7 8 9 2 3 4 5 b f g e d c 1 a d e e b e a1 a2 a pin a1 id pin a1 corner aj ar am an ap ak al 34 35 30 31 32 33
package information datasheet for mature altera devices 129 ? december 2011 altera corporation package information datasheet for mature altera devices 652-pin plastic ball-grid array (bga), option 3?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt or tape solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-192 variation: baw-1 lead coplanarity 0.008 inches (0.20 mm) weight 15.1 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.00 a1 0.35 ? ? a2 0.25 ? 1.10 d 45.00 bsc e 45.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
130 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline bottom view top view d e pin a1 id b e a1 a2 pin a1 corner a 34 12 ak n d c a b 1 j g e h f l k m aj ag ae ac aa u r t p w y v ah ad af ab 7 4 3 2 5 6 10 8 9 11 ar an al ap am 24 23 18 15 14 13 16 17 20 21 19 22 29 26 25 28 27 32 30 31 33 35 e
package information datasheet for mature altera devices 131 ? december 2011 altera corporation package information datasheet for mature altera devices 655-pin ceramic pin-grid array (pga)?wire bond all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in inches. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference g package acronym pga leadframe material alloy 42 lead finish gold over nickel plate jedec outline reference mo-128 variation: ap lead coplanarity n/a weight 74.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol inches min. nom. max. a ? ? 0.205 a1 0.050 typ a2 ? ? 0.145 d 2.445 2.460 2.475 e 2.445 2.460 2.475 l 0.130 typ b 0.016 0.018 0.020 e 0.100 bsc
132 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 133 ? december 2011 altera corporation package information datasheet for mature altera devices 672-pin plastic ball-grid array (bga)?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: bar-2 lead coplanarity 0.008 inches (0.20 mm) weight 5.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.60 a1 0.35 ? ? a2 ? ? 2.20 a3 ? ? 1.80 d 35.00 bsc e 35.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
134 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a2 a e pin a1 id pin a1 corner top view bottom view a3 y aa w v r t u p 21 2426 25 22 23 15 1820 19 16 17 1214 13 10 11 j l m k g h f e 8 97 64 5 c d b a 2 31 d e b e a1 n af ad ae ac ab
package information datasheet for mature altera devices 135 ? december 2011 altera corporation package information datasheet for mature altera devices 672-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aal-1 lead coplanarity 0.008 inches (0.20 mm) weight 9.5 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 27.00 bsc e 27.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
136 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline e d e e a1 a2 b a3 a pin a1 id pin a1 corner bottom view top view
package information datasheet for mature altera devices 137 ? december 2011 altera corporation package information datasheet for mature altera devices 672-pin fineline ball-grid array (fbga), option 2?wire bond all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aal-1 lead coplanarity 0.008 inches (0.20 mm) weight 3.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 2.60 a1 0.30 ? ? a2 ? ? 2.20 a3 ? ? 1.80 d 27.00 bsc e 27.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
138 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e pin a1 id b a3 a1 a2 a pin a1 corner e e bottom view top view
package information datasheet for mature altera devices 139 ? december 2011 altera corporation package information datasheet for mature altera devices 672-pin fineline ball-grid array (fbga), option 4?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aal-1 lead coplanarity 0.008 inches (0.20 mm) weight 7.1 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 27.00 bsc d1 20.00 bsc e 27.00 bsc e1 20.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
140 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 141 ? december 2011 altera corporation package information datasheet for mature altera devices 672-pin fineline ball-grid array (fbga)?wire bond?a:2.40 all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aal-1 lead coplanarity 0.008 inches (0.20 mm) weight 3.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a 2.10 2.25 2.40 a1 0.40 0.50 0.60 a2 1.50 1.75 2.00 a3 1.12 1.17 1.22 d 27.00 bsc e 27.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
142 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a3 a1 a2 a b e e
package information datasheet for mature altera devices 143 ? december 2011 altera corporation package information datasheet for mature altera devices 724-pin ball-grid array (bga)?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: bar-1 lead coplanarity 0.008 inches (0.20 mm) weight 13.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 35.00 bsc e 35.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
144 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline d e e b e a3 a1 a2 a pin a1 id pin a1 corner bottom view top view
package information datasheet for mature altera devices 145 ? december 2011 altera corporation package information datasheet for mature altera devices 780-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aam-1 lead coplanarity 0.008 inches (0.20 mm) weight 10.7 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 29.00 bsc e 29.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
146 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline pin a1 id pin a1 corner bottom view top view e d e e a1 a2 b a3 a
package information datasheet for mature altera devices 147 ? december 2011 altera corporation package information datasheet for mature altera devices 780-pin fineline ball-grid array (fbga), option 1?flip chip?channel lid all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference mo-034 variation: aam-1 lead coplanarity 0.008 inches (0.20 mm) weight 9.5 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a 3.05 3.25 3.45 a1 0.40 0.50 0.60 a2 2.45 2.75 3.05 a3 1.45 1.55 1.65 d 29.00 bsc e 29.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
148 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline pin a1 id pin a1 corner bottom view top view e d e e a1 a2 b a3 a
package information datasheet for mature altera devices 149 ? december 2011 altera corporation package information datasheet for mature altera devices 780-pin fineline ball-grid array (fbga), option 3?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aam-1 lead coplanarity 0.008 inches (0.20 mm) weight 8.2 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 29.00 bsc d1 21.00 bsc e 29.00 bsc e1 21.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
150 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 151 ? december 2011 altera corporation package information datasheet for mature altera devices 896-pin fineline ball-grid array (fbga)?wire bond?a:2.40 all dimensions and tolerances conform to asme y14.5m ? 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition r egular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aan-1 lead coplanarity 0.008 inches (0.20 mm) weight 3.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a 2.10 2.25 2.40 a1 0.40 0.50 0.60 a2 1.50 1.75 2.00 a3 1.12 1.17 1.22 d 31.00 bsc e 31.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
152 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline a3 a1 a2 a b e e e d
package information datasheet for mature altera devices 153 ? december 2011 altera corporation package information datasheet for mature altera devices 956-pin ball-grid array (bga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: bau-1 lead coplanarity 0.008 inches (0.20 mm) weight 19.6 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 40.00 bsc e 40.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
154 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 155 ? december 2011 altera corporation package information datasheet for mature altera devices 956-pin ball-grid array (bga), option 2?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference b package acronym bga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: bau-1 lead coplanarity 0.008 inches (0.20 mm) weight 17.0 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 40.00 bsc d1 30.00 bsc e 40.00 bsc e1 30.00 bsc b 0.60 0.75 0.90 e 1.27 bsc
156 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 157 ? december 2011 altera corporation package information datasheet for mature altera devices 1020-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aap-1 lead coplanarity 0.008 inches (0.20 mm) weight 13.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 33.00 bsc e 33.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
158 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 159 ? december 2011 altera corporation package information datasheet for mature altera devices 1020-pin fineline ball-grid array (fbga), option 2?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aap-1 lead coplanarity 0.008 inches (0.20 mm) weight 10.8 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 33.00 bsc d1 26.00 bsc e 33.00 bsc e1 26.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
160 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 161 ? december 2011 altera corporation package information datasheet for mature altera devices 1152-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aar-1 lead coplanarity 0.008 inches (0.20 mm) weight 15.5 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 35.00 bsc e 35.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
162 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 163 ? december 2011 altera corporation package information datasheet for mature altera devices 1152-pin fineline ball-grid array (fbga), option 2?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aar-1 lead coplanarity 0.008 inches (0.20 mm) weight 12.4 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 35.00 bsc d1 27.00 bsc e 35.00 bsc e1 27.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
164 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 165 ? december 2011 altera corporation package information datasheet for mature altera devices 1508-pin fineline ball-grid array (fbga), option 1?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aau-1 lead coplanarity 0.008 inches (0.20 mm) weight 18.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 40.00 bsc e 40.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
166 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices 167 ? december 2011 altera corporation package information datasheet for mature altera devices 1508-pin fineline ball-grid array (fbga), option 2?flip chip all dimensions and tolerances conform to asme y14.5m - 1994. controlling dimension is in millimeters. pin a1 may be indicated by an id dot, or a special feature, in its proximity on package surface. package information description specification ordering code reference f package acronym fbga substrate material bt solder ball composition regular: 63sn:37pb (typ.) pb-free: sn:3ag:0.5cu (typ.) jedec outline reference ms-034 variation: aau-1 lead coplanarity 0.008 inches (0.20 mm) weight 15.9 g (typ.) moisture sensitivity level printed on moisture barrier bag package outline dimension table symbol millimeters min. nom. max. a ? ? 3.50 a1 0.30 ? ? a2 0.25 ? 3.00 a3 ? ? 2.50 d 40.00 bsc d1 30.00 bsc e 40.00 bsc e1 30.00 bsc b 0.50 0.60 0.70 e 1.00 bsc
168 package information datasheet for mature altera devices package information datasheet for mature altera devices ? december 2011 altera corporation package outline
package information datasheet for mature altera devices i additional information ? december 2011 altera corporation package information datasheet for mature altera devices additional information this section contains revision history and contact information. revision history table 60 lists the revision history for this document. table 60. document revision history (1) (part 1 of 13) date and document version changes made summary of changes december 2011 added ?896-pin fineline ball-grid array (fbga)?wire bond? a:2.40?, ?484-pin fineline ball-grid array (fbga)?wire bond? a:2.40? , and ?672-pin fineline ball-grid array (fbga)?wire bond? a:2.40?. updated for version 16.8 november 2011 added table 9 on page 10. updated for version 16.7 august 2011 removed hardcopy iii, hardcopy iv, max v, max ii, classic, and epcs devices? package listing and thermal resistance values. updated for version 16.6 july 2011 removed arria ii, stratix v, stratix iv, stratix iii, cyclone iv, and cyclone iii devices? package listing and thermal resistance values. updated for version 16.5
ii package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation june 2011 updated package diagram in ?780-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep3sl150)? and ?780-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep3se110)? added table 30 and table 58. updated the a and a2 dimension values in ?780-pin fineline ball- grid array (fbga)?flip chip?channel lid (ep4sgx230)? and ?780- pin fineline ball-grid array (fbga)?flip chip?channel lid (ep4se230)?. updated the d1 and e1 dimension values in ?1152-pin fineline ball- grid array (fbga)?flip chip?single-piece lid (ep4sgx290)? and ?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx360)?. updated table 13. updated the b, a, and a2 dimension values in ?256-pin ultra fineline ball-grid array (ubga)?wire bond?thin (ep3c10)?, ?256-pin ultra fineline ball-grid array (ubga)?wire bond?thin (ep3c16)? and ?256-pin ultra fineline ball-grid array (ubga)?wire bond? thin (ep3c25)?. updated information in ?package outlines?. added new package diagram for ?1152-pin fineline ball-grid array (hbga)?flip chip?dual-piece lid (ep3sl340)?, and ?780-pin fineline ball-grid array (fbga)?flip chip?channel lid (ep4sgx180)?. added new 1760-pin packages for 5sgxb5 and 5sgxb6 devices: ?1760-pin fineline ball-grid array (fbga)?flip chip?single-piece lid?a:3.40? to replace the 1932-pin packages for 5sgxb5 and 5sgxb6 devices. updated cross reference for 5sgxb5 and 5sgxb6 1517-pin package diagram in table 3. updated table table 33. updated for version 16.4 table 60. document revision history (1) (part 2 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices iii additional information ? december 2011 altera corporation package information datasheet for mature altera devices december 2010 updated document title and metadata. updated table 43 with new thermal resistance value for ep3c16 (u484 wire bond package) and ep3c40 (u484 wire bond and f780 wire bond packages). updated note 3 in table 9. updated table 19 and table 53 to remove dual-piece lid options for hardcopy ii devices. added arria ii gz device package listing in table 2 and arria ii gz thermal resistance in table 35. added stratix v device package listing in table 4 and stratix v thermal resistance in table 37. added max v device package listing in table 13 and max v thermal resistance in table 46. added new cyclone iv device package in table 9 and thermal resistance values in table 42. updated lead coplanarity and a3 dimension values in 358-pin ultra fineline ball-grid array (ubga)?flip chip, 358-pin ultra fineline ball-grid array (ubga)?flip chip?lidless (ep2agx45), and 358- pin ultra fineline ball-grid array (ubga)?flip chip?lidless (ep2agx65). added new package diagram for 1932-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx360), 324-pin fineline ball-grid array (fbga)?wire bond (epm2210), and 324- pin fineline ball-grid array (fbga)?wire bond (epm2210g). updated for version 16.3 table 60. document revision history (1) (part 3 of 13) date and document version changes made summary of changes
iv package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation september 2010 updated jedec outline reference for ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond (ep3c10)?, ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond?(ep3c16)?, and ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond? (ep3c25)?. updated dimension value for arria ii gx devices: ?572-pin fineline ball-grid array (fbga)?lidless?flip chip (ep2agx95)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx95)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx95)?, ?572-pin fineline ball-grid array (fbga)?lidless? flip chip (ep2agx65)?, ?780-pin fineline ball-grid array (fbga)? flip chip?lidless (ep2agx65)?, ?572-pin fineline ball-grid array (fbga)?lidless?flip chip (ep2agx45)?,?780-pin fineline ball- grid array (fbga)?flip chip?lidless (ep2agx45)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx260)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx260)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx190)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx190)?, ?1152-pin fineline ball- grid array (fbga)?flip chip?lidless (ep2agx125)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx125)?, and ?572-pin fineline ball-grid array (fbga)?lidless?flip chip (ep2agx125)?. updated dimension value for hardcopy devices: ? 1517-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e35)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e35)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?lidless (hc335)?, ?1152-pin fineline ball-grid array (fbga)?flip chip? lidless (hc335)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc325)?, ?484-pin fineline ball-grid array (fbga)? flip chip?lidless (hc4e25)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e25)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx15)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx25)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx25)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx35)?, and ?1517-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx35)?. revised the unit weight info for: ?484-pin fineline ball-grid array (fbga), option 1?flip chip?, ?484-pin fineline ball-grid array (fbga), option 4?flip chip?, ?572-pin fineline ball-grid array (fbga)?option 1, flip chip?, ?572-pin fineline ball-grid array (fbga)?option 2, flip chip?, ?672-pin fineline ball-grid array (fbga), option 1?flip chip?, ?672-pin fineline ball-grid array (fbga), option 4?flip chip?, ?780-pin fineline ball-grid array (fbga), option 1?flip chip?, ?780-pin fineline ball-grid array (fbga), option 3?flip chip?, ?780-pin fineline ball-grid array (fbga), option 4?flip chip??1020-pin fineline ball-grid array (fbga), option 1?flip chip?, and ?1020-pin fineline ball-grid array (fbga), option 2?flip chip?. updated for version 16.2 table 60. document revision history (1) (part 4 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices v additional information ? december 2011 altera corporation package information datasheet for mature altera devices revised the unit weight info for: ?1152-pin fineline ball-grid array (fbga), option 1?flip chip?, ?1152-pin fineline ball-grid array (fbga), option 2?flip chip?, ?1152-pin fineline ball-grid array (fbga), option 3?flip chip?, ?1508-pin fineline ball-grid array (fbga), option 1?flip chip?, ?1508-pin fineline ball-grid array (fbga), option 2?flip chip?, ?1517-pin fineline ball-grid array (fbga), option 1?flip chip?, ?1517-pin fineline ball-grid array (fbga), option 2?flip chip?, ?1760-pin fineline ball-grid array (fbga), option 1?flip chip?, ?1760-pin fineline ball-grid array (fbga), option 2?flip chip?, ?1932-pin fineline ball-grid array (fbga), option 1?flip chip?, ?1932-pin fineline ball-grid array (fbga), option 2?flip chip?, ?484-pin hybrid fineline ball-grid array (hbga)?flip chip?, ?780-pin hybrid fineline ball-grid array (hbga)?flip chip?, ?1517-pin hybrid fineline ball-grid array (hbga), option 1?flip chip?, ?1517-pin hybrid fineline ball-grid array (hbga), option 2?flip chip?, ?1152-pin hybrid fineline ball- grid array (hbga), option 1?flip chip?, ?1152-pin hybrid fineline ball-grid array (hbga), option 2?flip chip?, ?1152-pin hybrid fineline ball-grid array (hbga), option 3?flip chip?, and ?1152-pin hybrid fineline ball-grid array (hbga), option 4?flip chip?. added package diagram: ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond (ep3c10)?, ?148-pin quad flat no-lead package (qfn)?wire bond?, ?780-pin fineline ball-grid array (fbga), option 4?flip chip?, ?1152-pin fineline ball-grid array (fbga), option 3?flip chip?, and ?572-pin fineline ball-grid array (fbga)?option 2, flip chip?. added package diagram for stratix iv devices: ?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx290)?, ?780-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx110)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx110)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?channel lid (ep4sgx180)?,?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx180)?, ?1932-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx290)?, ?780-pin hybrid fineline ball-grid array (hbga)?flip chip?channel lid (ep4sgx360)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx360)?, ?1760-pin fineline ball-grid array (fbga) ? flip chip ? single-piece lid (ep4sgx360)?, ?1517-pin hybrid fineline ball-grid array (hbga)?flip chip?dual-piece lid (ep4se530)?, ?1517-pin hybrid fineline ball-grid array (hbga)?flip chip? single-piece lid (ep4se530)?, ?780-pin fineline ball-grid array (fbga)?flip chip?channel lid (ep4se230)?, and ?1152-pin hybrid ball-grid array (hbga)?flip chip?single-piece lid (ep4se530)?. table 60. document revision history (1) (part 5 of 13) date and document version changes made summary of changes
vi package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation added package diagram for stratix iii devices: ?780-pin fineline ball- grid array (fbga)?flip chip?dual-piece lid (ep3sl150)?, ?780- pin hybrid fineline ball-grid array (hbga)?flip chip?dual-piece lid (ep3sl200)?,?1152-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep3se110)?, ?780-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep3se110)?, ?780-pin hybrid fineline ball-grid array (hbga)?flip chip?dual-piece lid (ep3se260)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?channel lid (ep3se260)?, and ?1152-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep3se260)?. added package diagram for cyclone iv devices: ?780-pin fineline ball-grid array (fbga)?wire bond?ompac (ep4ce115)?. added package diagram for cyclone iii devices :?780-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c120)?, ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond? (ep3c16)?,?256-pin ultra fineline ball-grid array (ubga)?wire bond?thin (ep3c10)?, ?780-pin fineline ball-grid array (fbga)? wire bond?ompac (ep3c55)?, ?144-pin plastic enhanced quad flat pack (eqfp)?wire bond?(ep3c25)?, ?256-pin fineline ball- grid array (fbga)?wire bond?thin (ep3c10)?, ?780-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c80)?,?484-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c120)?, ?256-pin fineline ball-grid array (fbga)?wire bond?thin (ep3c16)?, ?256-pin fineline ball-grid array (fbga)?wire bond? thin (ep3c25)?, ?324-pin fineline ball-grid array (fbga)?wire bond (ep3c25)?, ?324-pin fineline ball-grid array (fbga)?wire bond (ep3c40)?, ?484-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c16)?, ?484-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c40)?, ?484-pin fineline ball- grid array (fbga)?wire bond?ompac (ep3c55)?, ?484-pin fineline ball-grid array (fbga)?wire bond?ompac (ep3c80)?, ?484-pin ultra fineline ball-grid array (ubga)?wire bond (ep3cls100)?, ?256-pin ultra fineline ball-grid array (ubga)? wire bond?thin (ep3c16)?, ?484-pin ultra fineline ball-grid array (ubga)?wire bond (ep3c16)?, ?256-pin ultra fineline ball-grid array (ubga)?wire bond?thin (ep3c25)?, ?484-pin ultra fineline ball-grid array (ubga)?wire bond (ep3c55)?, and ?484-pin ultra fineline ball-grid array (ubga)?wire bond (ep3c80)?. added package diagram for max ii devices: ?100-pin fineline ball- grid array (fbga)?wire bond?thin (epm240)?, ?100-pin fineline ball-grid array (fbga)?wire bond?thin (epm570)?. updated a3 dimension for ?572-pin fineline ball-grid array (fbga)?lidless?flip chip (ep2agx45)?, ?572-pin fineline ball- grid array (fbga)?lidless?flip chip (ep2agx65)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx45)?, and ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (ep2agx65)?. table 60. document revision history (1) (part 6 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices vii additional information ? december 2011 altera corporation package information datasheet for mature altera devices added package diagram for hardcopy iii devices: ?484-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (hc325)? and ?484-pin fineline ball-grid array (fbga)?flip chip?lidless (hc325)?. updated d1/e1 values in ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4s40g2)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4s100g2)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx180)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx230)?, ?484-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e25)?, ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e25)?, and ?1020-pin fineline ball-grid array (fbga), option 2?flip chip?. updated table 7. updated table 10 footnote. updated thermal resistance values of ep3cls70, ep3cls100, ep3cls150, and ep3cls200 devices f484 pin package in table 42. updated package diagram in ?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4sgx360)? updated the notes in ?256-pin fineline ball-grid array (fbga), option 1?wire bond? and ?256-pin fineline ball-grid array (fbga), option 2?thin?wire bond? to include cyclone iv devices. updated ep4se230 device package to channel lid from dual-piece lid in table 4. updated package diagram in ?1517-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep4sgx180)?. updated ep1agx50 and ep1agx60 f484 pin package description from dual-piece lid to channel lid in table 3. updated ep4sgx180 and ep4sgx230 device package description in table 4. added note 1 to table 6. deleted hc315wf484 from table 18. added additional information to ?148-pin quad flat no-lead package (qfn)?wire bond?(ep4cgx15)? and ?148-pin quad flat no-lead package (qfn)?wire bond? table 60. document revision history (1) (part 7 of 13) date and document version changes made summary of changes
viii package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation april 2010 added table 1 and table 38 updated table 2 through table 37 updated values in table 49, table 50, table 58 removed 148-pin quad flat no-lead package (qfn)?wire bond, 484-pin fbga, flip chip, dual-piece lid (ep2s15), 484-pin fbga, flip chip, single-piece lid (ep2s15), 672-pin fbga, flip chip, dual- piece lid (ep2s15), 672-pin fbga, flip chip, single-piece lid (ep2s15) package outlines. corrected title in 1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (hc4e35) added 148-pin quad flat no-lead package (qfn)?wire bond? (ep4cgx15) added 1517-pin fineline ball-grid array (fbga)?flip chip?single- piece lid (ep4s40g2), 1517-pin fineline ball-grid array (fbga)? flip chip?single-piece lid (ep4s100g2), 1517-pin hybrid fineline ball-grid array (hbga)?flip chip?single-piece lid (ep4s40g5), and 1932-pin fineline ball-grid array (fbga)?flip chip?single- piece lid (ep4s100g4) added 1152-pin hybrid ball-grid array (hbga)?flip chip?single- piece lid (ep4se820), 1517-pin hybrid ball-grid array (hbga)?flip chip?single-piece lid (ep4se820), and 1760-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (ep4se820) added 1517-pin fineline ball-grid array (fbga)?flip chip?single- piece lid (ep4sgx180) and 1517-pin fineline ball-grid array (fbga)?flip chip?dual-piece lid (ep4sgx180) added 1517-pin fineline ball-grid array (fbga)?flip chip?dual- piece lid (ep4sgx230) added ?484-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e25)?, ?484-pin fineline ball-grid array (fbga)?flip chip? single-piece lid (hc4e25)?, and ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4e25)? added ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx15)?, and ?780-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (hc4gx15)? added ?780-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx25)?, ?780-pin fineline ball-grid array (fbga)?flip chip? single-piece lid (hc4gx25)?, ?1152-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx25)?, and ?1152-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (hc4gx25)? updated for version 16.1 table 60. document revision history (1) (part 8 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices ix additional information ? december 2011 altera corporation package information datasheet for mature altera devices added ?1152-pin fineline ball-grid array (fbga)?flip chip? single-piece lid (hc4gx35)?, ?1517-pin fineline ball-grid array (fbga)?flip chip?lidless (hc4gx35)?, and ?1517-pin fineline ball-grid array (fbga)?flip chip?single-piece lid (hc4gx35)? updated 1517-pin fineline ball-grid array (fbga)?flip chip? single-piece lid (ep4sgx230) corrected title for 324-pin fineline ball-grid array (fbga)?wire bond?option 1 from 324-pin fineline ball-grid array (fbga) corrected title for 1517-pin hybrid fineline ball-grid array (hbga) ? flip chip ? single-piece lid (ep4se820) from 1517-pin hybrid fineline ball-grid array (hbga)?flip chip?single-piece lid (ep4sgx820) corrected weight in 324-pin fbga data sheet added thermal resistance disclaimer at the beginning of the thermal resistance section moved epc1, epc2, epc1441 entries from table 27 to table 37 december 2009 added notes for preliminary thermal information (table 36, table 37, table 46, and table 47) updated for version 16.0 table 60. document revision history (1) (part 9 of 13) date and document version changes made summary of changes
x package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation november 2009 added cyclone iv information added notes to 1152-pin hbga option 3 data sheet corrected drawings for 358-pin ubga?lidless (ep2agx45), 358-pin ubga?lidless (ep2agx65), and 1152-pin fbga?lidless (ep2agx95) data sheets added 148-pin qfn, 169-pin fbga, and 324-pin fbga option 2 data sheets added 1517-pin?lidless (hc4e35) and 1517-pin single-piece lid (hc4e35) data sheets added 780-pin fbga?channel lid (ep4sgx230), 780-pin hbga? channel lid (ep4sgx 360), 1152-pin fbga?channel lid (ep4sgx230), 1152-pin fbga?channel lid (ep4sgx360), 1152-pin fbga?dual-piece lid (ep4sgx230), 1152-pin fbga? single-piece lid (ep4sgx230), 1152-pin fbga?single-piece lid (ep4sgx360), 1152-pin hbga?single-piece lid (ep4sgx530), 1152-pin hbga?single-piece lid (ep4sgx820), 1517-pin fbga? dual-piece lid (ep4sgx230), 1517-pin fbga?single-piece lid (ep4sgx230), 1517-pin fbga? single-piece lid (ep4sgx360), 1517-pin hbga?dual-piece lid (ep4sgx530), 1517-pin hbga?single-piece lid (ep4sgx530), 1517-pin hbga?single-piece lid (ep4s40g2 and ep4s100g2), 1517-pin hbga?single-piece lid (ep4s100g5), 1517-pin hbga? single-piece lid (ep4sgx820), 1760-pin fbga?dual-piece lid (ep4sgx530), 1760-pin fbga?single-piece lid (ep4sgx360), 1760-pin fbga?single-piece lid (ep4sgx820), 1932-pin fbga? dual-piece lid (ep4sgx530), 1932-pin fbga?single-piece lid (ep4sgx530), 1932-pin fbga?single-piece lid (ep4s100g2) data sheets added 484-pin fbga?dual-piece lid (ep2s15), 484-pin fbga? single-piece lid (ep2s15), 672-pin fbga?dual-piece lid (ep2s15), 672-pin fbga?single-piece lid (ep2s15), 164-pin mbga (ep3c16), and 484-pin ubga (ep3c40) data sheets updated for version 15.9 table 60. document revision history (1) (part 10 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices xi additional information ? december 2011 altera corporation package information datasheet for mature altera devices october 2009 added 1152-pin hbga option 3, 1152-pin hbga option 4, 1517-pin hbga option 2, 1760-pin fbga option 2, and 1932-pin fbga option 2 data sheets added 358-pin ubga?lidless (ep2agx45), 358-pin ubga?lidless (ep2agx65), 572-pin fbga?lidless (ep2agx45), 572-pin fbga? lidless (ep2agx65), 572-pin fbga?lidless (ep2agx95), 572-pin fbga?lidless (ep2agx125), 780-pin fbga?lidless (ep2agx45), 780-pin fbga?lidless (ep2agx65), 780-pin fbga?lidless (ep2agx95), 780-pin fbga?lidless (ep2agx125), 780-pin fbga?lidless (ep2agx190), 780-pin fbga?lidless (ep2agx260), 1152-pin fbga?lidless (ep2agx95), 1152-pin fbga?lidless (ep2agx125), 1152-pin fbga?lidless (ep2agx190), and 1152-pin fbga?lidless (ep2agx260) data sheets added 780-pin fbga?lidless (hc325), 780-pin fbga?single- piece lid (hc325), 1152-pin fbga?lidless (hc335), 1152-pin fbga?single-piece lid (hc335), 1152-pin fbga?lidless (hc4e35), 1152-pin fbga?single-piece lid (hc4e35), 1517-pin fbga?lidless (hc335), and 1517-pin fbga?single-piece lid (hc335) data sheets removed ep2agx20 and ep2agx30 entries from table 2 and table 39 added ep4se820 entries to table 41 added stratix iv gt devices to table 4; added option references updated thermal resistance values in table 39 updated for version 15.8 june 2009 made three corrections to stratix iii thermal resistance table added cyclone iii ls information added stratix iv gt thermal resistance values added and/or hardcopy iii and iv cross-reference and thermal resistance tables updated hardcopy iii and iv part numbers added cyclone iii m164 package information added 484-pin fbga option 4, 672-pin fbga option 4, 1020-pin fbga option 2, 1508-pin fbga option 2, and 1517-pin option 2 fbga data sheets revised 1508-pin fbga option 1, 1020-pin fbga option 1, 1517-pin fbga option 1, 572-pin fbga, and 1152-pin fbga option 2 data sheets added 956-pin bga option 2 data sheet updated for version 15.7 march 2009 corrected ?b nom.? value in 358-pin ubga data sheet corrected ?a max.? value and replaced package drawing in 780-pin fbga - option 3 data sheet corrected ?a max.? value in 256-pin ubga data sheet modified thermal resistance values for ep3sl200 device in stratix iii thermal resistance table updated for version 15.6 table 60. document revision history (1) (part 11 of 13) date and document version changes made summary of changes
xii package information datasheet for mature altera devices additional information package information datasheet for mature altera devices ? december 2011 altera corporation march 2009 fixed theta symbols in several data sheet dimension tables updated dimensions in 256-pin ubga data sheet added 358-pin ubga data sheet, 572-pin, 780-pin option 3, and 1152-pin option 2 fbga data sheets added arria ii gx thermal resistance table added arria ii gx device and package cross-reference table added ep3sl50, ep3se80, and ep3sl110 devices to stratix iii thermal resistance table added ep4sgx70, ep4sgx180, and ep4sgx290 devices and updated stratix iv gx thermal resistance table added hardcopy iii and hardcopy iv thermal resistance table miscellaneous formatting changes updated for version 15.5 december 2008 changed dimension ?a? max. value in 1932-pin fbga data sheet updated for version 15.4 november 2008 moved revision history to the end and added ?how to contact altera? section added subheadings in thermal resistance section converted to 8-1/2 x 11 page size changed ?maximum lead coplanarity? to ?lead coplanarity? and added ?(typ.)? to weights for all packages added ep2c15 information to cyclone ii tables updated for version 15.3 september 2008 added thermal resistance values for stratix iv added new 1152-pin hbga option 2 (42.5 mm sq.) data sheet added new 1517-pin hbga (42.5 mm sq.) data sheet added theta-jb thermal resistance values for stratix ii added hardcopy ii thermal resistance values revised weights for 256-pin bga option 2, 652-pin bga option 2, 652-pin bga option 3, 208-pin rqfp, 240-pin rqfp, and 304-pin rqfp data sheets added notes to 1152-pin fbga, 1517-pin fbga, 1760-pin fbga; changed dimension ?a? thickness and ?a2? thickness in 1932-pin fbga data sheet updated for version 15.2 may 2008 added 1932-pin fbga data sheet added device and package cross reference table for stratix iv updated for version 15.1 april 2008 revised maximum lead coplanarity values for 1517-pin fbga and 1760-pin fbga data sheets added three entries to table 3 corrected minor typos in table 4 and table 10 corrected hc210w package in table 12 many tables updated for formatting consistency updated for version 15.0 table 60. document revision history (1) (part 12 of 13) date and document version changes made summary of changes
package information datasheet for mature altera devices xiii additional information ? december 2011 altera corporation package information datasheet for mature altera devices february 2008 added 164-pin mbga information in table 8 added hardcopy ii device information in table 12 updated stratix iii thermal resistance values in table 22 added 164-pin mbga data sheet corrected 8-pin soic data sheet (changed ?b? to ?b? in package outline dimension table) corrected 68-pin mbga data sheet (changed ?inches? to ?millimeters? in package outline dimension table) updated for version 14.9 october 2007 removed note from 100-pin pqfp option 1 data sheet removed 100-pin pqfp option 2 data sheet updated 88-pin ubga, 144-pin eqfp, 256-pin fbga option 1, 256- pin fbga option 2, 256-pin ubga, 1517-pin fbga, and 1760-pin fbga data sheets added 780-pin hbga and 1152-pin hbga data sheets updated for version 14.8 may 2007 v14.7 added arria ? gx information added cyclone iii tables revised d2 and e2 dimensions for 144-pin eqfp revised 100-pin mbga - wire bond and 256-pin mbga - wire bond added 780-pin fbga option 2 - wire bond, 256-pin ubga - wire bond, 68-pin mbga - wire bond, and 144-pin mbga - wire bond changes and additions as described in ?changes made? section february 2007 v14.6 updated 144-pin plastic thin quad flat pack (tqfp) data sheet to correct title and ordering code reference added revision history revised one data sheet (144-pin plastic thin quad flat pack (tqfp) data sheet), added revision history december 2006 v14.5 table 2 was added for stratix iii device and package cross-reference tables 16, 17, and 18 were added for stratix iii thermal resistance information 1517-pin fineline ball-grid array (fbga) - flip chip data sheet was added 1760-pin fineline ball-grid array (fbga) - flip chip data sheet was added "wire bond" and "flip chip" was added to title of each data sheet, as appropriate "bga" was spelled out as "ball-grid array" in all titles some package outline drawings were reformatted weights were updated for many packages added tables for stratix iii, updated other data sheets note to table 60 : (1) formal revision history for this document began with version 14.5. table 60. document revision history (1) (part 13 of 13) date and document version changes made summary of changes
101 innovation drive san jose, ca 95134 www.altera.com technical support www.altera.com/support copyright ? december 2011. altera corporation. all rights reserved. altera, the programmable solutions company, the stylized altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of altera corporation in the u.s. and other countries. all other product or service names are the property of their respective holders. altera products are protected under numerous u.s. and foreign patents and pending applications, maskwork rights, and copyrights. altera warrants performance of its semiconductor products to current specifications in accordance with altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by altera corporation. altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services . additional information how to contact altera for the most up-to-date information about altera ? products, see the following table. contact (note 1) contact method address technical support website www.altera.com/support technical training website www.altera.com/training email custrain@altera.com altera literature services email literature@altera.com non-technical support (general) email nacomp@altera.com (software licensing) email authorization@altera.com note: (1) you can also contact your local altera sales office or sales representative.

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